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| 型号： | AN-5026 |
| 厂商： | Fairchild Semiconductor Corporation |
| 元件分类： | 圆形连接器 |
| 英文描述： | Circular Connector; No. of Contacts:19; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:15; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No |
| 中文描述： | 使用的BGA封装 |
| 文件页数： | 4/8页 |
| 文件大小： | 722K |
| 代理商： | AN-5026 |
www.fairchildsemi.com
4
A
BGA Via Design and Layout Options
When using vias in high bit-count devices such as the 48-bit FST32211 (see Figure 10), via density and placement become
critical issues for the layout designer. The use of through-board vias allows access to all signal bits on the device; this helps
contribute to maximum space integration. Additionally, the board backside vias can be used to connect components such
as termination and decoupling devices if needed.
FIGURE 10. 114-Ball 48-Bit BGA with Vias (FST32211)
Note: For a via free 48-bit bus switch solution two FST16211
can be used with a minimal loss in space savings. (see Figure 4)
Figure 11 shows ball pads to via spacing with a BGA 0.8mm pitch and a 0.56mm via, which give a 0.11mm via to ball spac-
ing. Figure 12 shows a board cross-section with non-solder mask defined pads-to-via spacing dimensions. Manufacturing
technology and expense are the deciding factors in via size. Larger vias allow for more relaxed manufacturing rules and
lower costs. Smaller vias are more costly due to the high end manufacturing equipment and higher drill bit breakage.
FIGURE 11. BGA Via to Ball Spacing Diagram
FIGURE 12. Board with Non-Solder Mask Defined Pads to Via Spacing
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