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| 型号： | AN-5026 |
| 厂商： | Fairchild Semiconductor Corporation |
| 元件分类： | 圆形连接器 |
| 英文描述： | Circular Connector; No. of Contacts:19; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:15; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No |
| 中文描述： | 使用的BGA封装 |
| 文件页数： | 7/8页 |
| 文件大小： | 722K |
| 代理商： | AN-5026 |
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www.fairchildsemi.com
A
BGA Testing
During the prototype and engineering debug phase it may
be necessary to access IC signals for testing purposes.
Several options exist depending on the specific needs of
the system being developed.
1. Prototype socket for the BGA
2. Via fanout
3. PCB solder mask defined lands
Each of the methods offers advantages and disadvan-
tages. The prototype socket gives the designer the ability
to test multiple devices in the socketed connection. The via
fan-out method, as shown in Figure 17, incorporates a
mounted BGA routed through an array of vias for signal
accessibility.
With form factor boards large via arrays remove all the board real estate advantage gained with the BGA packaging. Lim-
ited I/O access can still be gained using test points like those shown in Figure 18.
Minimum Size Via Defined Pattern for Prototype Testing
19 x 6 ARRAY 0.8mm pitch with package dimensions of 16.0mm x 5.5mm
Overall dimensions (including TestVia's) 20.1mm x 8.8mm
22mil vias, 15mil holes; 6mil line and space PCB rules
FIGURE 17. Via Fan-out for Prototype Testing
Solder Mask Defined Land Pattern for In-System Testing
FIGURE 18. BGA In-System Testing
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