参数资料
型号: APA300-FGG256
厂商: Microsemi SoC
文件页数: 137/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 300K 256-FBGA
标准包装: 90
系列: ProASICPLUS
RAM 位总计: 73728
输入/输出数: 186
门数: 300000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
v5.9
2-51
Module Delays
Sample Macrocell Library Listing
Figure 2-26 Module Delays
Table 2-47 Worst-Case Military Conditions1
VDD = 2.3 V, TJ = 70 C, TJ = 70°C, TJ = 125°C for Military/MIL-STD-883
Cell Name
Description
Std.
Max
Min
Units
NAND2
2-Input NAND
0.5
ns
AND2
2-Input AND
0.7
ns
NOR3
3-Input NOR
0.8
ns
MUX2L
2-1 MUX with Active Low Select
0.5
ns
OA21
2-Input OR into a 2-Input AND
0.8
ns
XOR2
2-Input Exclusive OR
0.6
ns
LDL
Active Low Latch (LH/HL)
LH2
0.9
ns
CLK-Q
HL2
0.8
ns
tsetup
0.7
ns
thold
0.1
ns
DFFL
Negative Edge-Triggered D-type Flip-Flop (LH/HL)
CLK-Q
LH2
0.9
ns
HL2
0.8
ns
tsetup
0.6
ns
thold
0.0
ns
Notes:
1. Intrinsic delays have a variable component, coupled to the input slope of the signal. These numbers assume an input slope typical of
local interconnect.
2. LH and HL refer to the Q transitions from Low to High and High to Low, respectively.
A
B
50%
Y
50%
50% 50%
50%
C
50%50%
50%
t
DALH
t
DBLH
t
DAHL
t
DBHL
t
DCHL
t
DCLH
A
B
C
Y
相关PDF资料
PDF描述
APA300-FG256 IC FPGA PROASIC+ 300K 256-FBGA
AGLE600V5-FG484 IC FPGA 1KB FLASH 600K 484-FBGA
AGLE600V5-FGG484 IC FPGA 1KB FLASH 600K 484-FBGA
A42MX24-FTQG176 IC FPGA MX SGL CHIP 36K 176-TQFP
AYM36DRMH CONN EDGECARD 72POS .156 WW
相关代理商/技术参数
参数描述
APA300-FGG256A 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
APA300-FGG256I 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA300-FGG256M 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 300K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays
APA300-FGGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA300-FGGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs