参数资料
型号: APA600-BG456
厂商: Microsemi SoC
文件页数: 131/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 456-PBGA
标准包装: 24
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 356
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 456-BBGA
供应商设备封装: 456-PBGA(35x35)
ProASICPLUS Flash Family FPGAs
2- 46
v5.9
Input Buffer Delays
Figure 2-25 Input Buffer Delays
Table 2-35 Worst-Case Commercial Conditions
VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C
Macro Type
Description
Max. tINYH
1
Max. tINYL
2
Units
Std.
IB33
3.3 V, CMOS Input Levels3, No Pull-up Resistor
0.4
0.6
ns
IB33S
3.3 V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger
0.6
0.8
ns
Notes:
1. tINYH = Input Pad-to-Y High
2. tINYL = Input Pad-to-Y Low
3. LVTTL delays are the same as CMOS delays.
4. For LP Macros, VDDP=2.3 V for delays.
Table 2-36 Worst-Case Commercial Conditions
VDDP = 2.3 V, VDD = 2.3 V, TJ = 70°C
Macro Type
Description
Max. tINYH
1
Max. tINYL
2
Units
Std.
IB25LP
2.5 V, CMOS Input Levels3, Low Power
0.9
0.6
ns
IB25LPS
2.5 V, CMOS Input Levels3, Low Power, Schmitt Trigger
0.7
0.9
ns
Notes:
1. tINYH = Input Pad-to-Y High
2. tINYL = Input Pad-to-Y Low
3. LVTTL delays are the same as CMOS delays.
4. For LP Macros, VDDP =2.3 V for delays.
PAD
Y
PAD
V
DDP
0 V
50%
Y
GND
V
DD
50%
t
INYH
50%
IBx
t
INYL
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APA600-BGG456 功能描述:IC FPGA PROASIC+ 600K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)