参数资料
型号: AS1109 EB
厂商: ams
文件页数: 4/25页
文件大小: 0K
描述: BOARD EVAL AS1109
标准包装: 1
电流 - 输出 / 通道: 0.5 ~ 100 mA
输出及类型: 8,非隔离
输出电压: 0 ~ 15 V
特点: 过热保护,开路 LED,短路 LED,诊断
输入电压: 3 ~ 5.5 V
已供物品:
已用 IC / 零件: AS1109
AS1109
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD to GND
Input Voltage
Output Voltage
GND Pin Current
-0.3
-0.4
-0.4
7
V DD + 0.4
15
1000
V
V
V
mA
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
2
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
33
oC/W
on PCB, 16-pin SOIC-150 package
Thermal Resistance Θ JA
113
32
oC/W
oC/W
on PCB, 16-pin QSOP-150 package
on PCB, 16-pin QFN (4x4mm) package
Storage Temperature Range
-55
+150
oC
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
QFN and QSOP
5
1
85
%
Represents a maximum floor life time of unlimited
Moisture Sensitive Level
Moisture Sensitive
Layer (SOIC)
3
Represents a maximum floor life of 168h
Revision 1.21
3 - 24
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