参数资料
型号: AS1110 EB
厂商: ams
文件页数: 4/25页
文件大小: 0K
描述: BOARD EVAL AS1110
标准包装: 1
电流 - 输出 / 通道: 0.5 ~ 100 mA
输出及类型: 16,非隔离
输出电压: 0 ~ 15 V
特点: 过热保护,开路 LED,短路 LED,诊断
输入电压: 3 ~ 5.5 V
已供物品:
已用 IC / 零件: AS1110
AS1110
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V DD to GND
Input Voltage
Output Voltage
GND Pin Current
Thermal Resistance Θ JA
Ambient Temperature
Storage Temperature
Min
0
-0.4
-0.4
-40
-55
Max
7
V DD
+0.4
15
2000
2800
88
23
+85
150
Units
V
V
V
mA
mA
oC/W
oC/W
oC
oC
Comments
24-pin SSOP package
28-pin QFN (5x5mm) package
on PCB, 24-pin SSOP package
on PCB, 28-pin QFN (5x5mm) package
Humidity
Electrostatic Discharge
Digital Outputs
All Other Pins
5
2
2
86
%
kV
Non-condensing
Norm: MIL 833 E method 3015
Latch-Up Immunity
Package Body Temperature
SOIC
Moisture Sensitivity
Level
QFN
-100 -
(I NOM x 0.5)
3
1
+100 +
I NOM
+260
mA
oC
EIA/JESD78
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020D
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Represents a maximum floor life of 168h
Represents an infinite floor lifetime
Revision 1.6
3 - 24
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