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参数资料
| 型号： | AS8501-ASOU |
| 厂商： | ams |
| 文件页数： | 23/41页 |
| 文件大小： | 0K |
| 描述： | IC DATA ACQ 16-SOIC |
| 特色产品： | AS8501 High Precision Data Acquisition Ics |
| 标准包装： | 46 |
| 类型： | 数据采集系统（DAS） |
| 输入类型： | 模拟，数字 |
| 输出类型： | 模拟，数字 |
| 接口： | 串行 |
| 电流 - 电源： | 5mA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 803 (CN2011-ZH PDF) |
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AS8501 - Data Sheet
austriamicrosystems
Revision 1.1, 04-April-06
www.austriamicrosystems.com
Page 2 of 40
CONTENTS
1
FEATURES ........................................................................................................................................................................................ 1
2
APPLICATIONS................................................................................................................................................................................. 1
3
GENERAL DESCRIPTION ................................................................................................................................................................ 1
4
PIN FUNCTION DESCRIPTION FOR SOIC 16 PACKAGE.............................................................................................................. 3
5
ABSOLUTE MAXIMUM RATINGS.................................................................................................................................................... 4
6
ELECTRICAL CHARACTERISTICS ................................................................................................................................................. 5
7
FUNCTIONAL DESCRIPTION .......................................................................................................................................................... 9
7.1
POWER ON RESET........................................................................................................................................................................... 9
7.2
ANALOG PART, GENERAL DESCRIPTION ............................................................................................................................................ 9
7.2.1
Reference voltage ............................................................................................................................................................ 10
7.2.2
Current sources ................................................................................................................................................................ 11
7.2.3
Internal temperature sensor ............................................................................................................................................. 12
7.3
DIGITAL PART................................................................................................................................................................................ 12
7.3.1
Sampling rate ................................................................................................................................................................... 12
7.3.2
Calibration ........................................................................................................................................................................ 13
7.4
MODES OF OPERATION .................................................................................................................................................................. 13
7.5
REGISTER DESCRIPTION ................................................................................................................................................................ 15
7.5.1
OPM operation mode register ( 4 bits ) ............................................................................................................................ 16
7.5.2
CRG general configuration register ( 28 bits ) .................................................................................................................. 16
7.5.3
CRA measurement channel A configuration register ( 17 bits ) ..................................................................................... 17
7.5.4
CRB measurement channel B configuration register ( 17 bits ) ...................................................................................... 19
7.5.5
ZZR Zener-Zap register (188 bits ).................................................................................................................................. 20
7.5.6
CAR calibration register ( 110 bits )................................................................................................................................. 22
7.5.7
TRR trimming register ( 20 bits ) ...................................................................................................................................... 22
7.5.8
THR alarm (Wake-up) threshold register ( 17 bits )......................................................................................................... 25
7.5.9
MSR measurement result register ( 18 bits )................................................................................................................... 25
8
DIGITAL INTERFACE DESCRIPTION............................................................................................................................................ 25
8.1
CLK ............................................................................................................................................................................................. 25
8.2
INTN............................................................................................................................................................................................ 25
8.3
SDI BUS OPERATION...................................................................................................................................................................... 26
8.4
DATA TRANSFERS.......................................................................................................................................................................... 27
8.5
SDI BUS TIMING............................................................................................................................................................................. 28
8.6
SDI ACCESS TO OTP MEMORY....................................................................................................................................................... 29
8.6.1
ZZR register bit mapping .................................................................................................................................................. 29
8.6.2
Stored ZZR-register mapping ........................................................................................................................................... 33
9
GENERAL APPLICATION HINTS................................................................................................................................................... 34
9.1
GROUND CONNECTION, ANALOG COMMON....................................................................................................................................... 34
9.2
THERMAL EMF.............................................................................................................................................................................. 34
9.3
NOISE CONSIDERATIONS................................................................................................................................................................ 35
9.4
SHIELDING, GUARDING................................................................................................................................................................... 35
10
TYPICAL PERFORMANCE CHARACTERISTICS.......................................................................................................................... 36
11
PACKAGE DIMENSIONS................................................................................................................................................................ 38
12
REVISION HISTORY ....................................................................................................................................................................... 38
13
ORDERING INFORMATION............................................................................................................................................................ 38
14
CONTACT........................................................................................................................................................................................ 39
14.1
HEADQUARTERS ...................................................................................................................................................................... 39
14.2
SALES OFFICES ....................................................................................................................................................................... 39
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