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| 型号： | AT18F010-30XU |
| 厂商： | Atmel |
| 文件页数： | 6/16页 |
| 文件大小： | 0K |
| 描述： | IC FLASH CONFIG 1MBIT 20-TSSOP |
| 产品变化通告： | AT18F Family Obsolescence 06/Feb/2012 |
| 标准包装： | 74 |
| 可编程类型： | 闪存 |
| 存储容量： | 1Mb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 609 (CN2011-ZH PDF) |
14
3672A–CNFG–1/08
AT18F010/002/040/080 [Preliminary]
14. Packaging Information
14.1
20A2 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN4, 8-lead (6 x 6 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN4
11/14/01
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A
0.94
1.04
1.14
A1
0.30
0.34
0.38
b
0.45
0.50
0.55
1
D5.89
5.99
6.09
E4.89
5.99
6.09
e
1.27 BSC
e1
1.10 REF
L
0.95
1.00
1.05
1
L1
1.25
1.30
1.35
1
Note: 1. Metal Pad Dimensions.
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
6/3/02
20A2, 20-lead (4.4 x 6.5 mm Body), 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
20A2
C
A
D
A2
E
E1
e
b
Top View
Side View
L1
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D
6.40
6.50
6.60
2, 5
E
6.40 BSC
E1
4.30
4.40
4.50
3, 5
A
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
4
e
0.65 BSC
L
0.45
0.60
0.75
L1
1.00 REF
Notes:
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AC, for additional
information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
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