参数资料
型号: AT24C11Y1-10YU-1.8
厂商: Atmel
文件页数: 10/15页
文件大小: 0K
描述: IC EEPROM 1KBIT 1MHZ 8MAP
标准包装: 120
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 1K (128 x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MLP(2x3)
包装: 管件
AT24C11 Ordering Information (1)
Ordering Code
AT24C11-10PI-2.7
AT24C11N-10SI-2.7
AT24C11-10TI-2.7
AT24C11-10PI-1.8
AT24C11N-10SI-1.8
AT24C11-10TI-1.8
AT24C11-10PU-2.7 (2)
AT24C11-10PU-1.8 (2)
AT24C11N-10SU-2.7 (2)
AT24C11N-10SU-1.8 (2)
AT24C11-10TU-2.7 (2)
AT24C11-10TU-1.8 (2)
AT24C11-10TSU-1.8 (2)
AT24C11-W2.7-11 (3)
AT24C11-W1.8-11 (3)
Package
8P3
8S1
8A2
8P3
8S1
8A2
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
Die Sale
Die Sale
Operation Range
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Lead-free/Halogen-free/
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Notes:
8P3
8S1
8A2
5TS1
– 2.7
– 1.8
10
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Die sales available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die sales available upon request.
Please contact Serial EEPROM Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
Options
Low-Voltage (2.7V to 5.5V)
Low-Voltage (1.8V to 5.5V)
AT24C11
3409G–SEEPR–8/07
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