参数资料
型号: AT24C11Y1-10YU-1.8
厂商: Atmel
文件页数: 14/15页
文件大小: 0K
描述: IC EEPROM 1KBIT 1MHZ 8MAP
标准包装: 120
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 1K (128 x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MLP(2x3)
包装: 管件
5TS1 – SOT23
e 1
E 1
5
4
E
C
C L
L 1
1
2
TOP VIEW
b
3
A 2
A
END VIEW
SEATING
PLANE
e
D
SIDE VIEW
A 1
COMMON DIMENSIONS
(Unit of Measure = mm)
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
SYMBOL
MIN
NOM
MAX
NOTE
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
A
A 1
-
0.00
- 1.10
- 0.10
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
A 2
c
D
E
E 1
L 1
e
0.70
0.08
0.90 1.00
- 0.20
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
3
1,2
1,2
1,2
e 1
1.90 BSC
This drawing is for general information only. Refer to
JEDEC Drawing MO-193, Variation AB for additional
information.
b
0.30 - 0.50
3,4
6/20/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
DRAWING NO.
PO5TS1
REV.
A
14
AT24C11
3409G–SEEPR–8/07
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