参数资料
型号: AT24C11Y1-10YU-1.8
厂商: Atmel
文件页数: 11/15页
文件大小: 0K
描述: IC EEPROM 1KBIT 1MHZ 8MAP
标准包装: 120
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 1K (128 x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MLP(2x3)
包装: 管件
AT24C11
6. Packaging Information
8P3 – PDIP
1
E
E1
N
Top View
c
eA
End View
D
e
COMMON DIMENSIONS
(Unit of Measure = inches)
D1
A2 A
SYMBOL
MIN
NOM
MAX
NOTE
A
0.210
2
A2
0.115
0.1 3 0
0.195
b
b2
b 3
c
D
0.014
0.045
0.0 3 0
0.00 8
0. 3 55
0.01 8
0.060
0.0 3 9
0.010
0. 3 65
0.022
0.070
0.045
0.014
0.400
5
6
6
3
b2
L
D1
0.005
3
b 3
4 PLC S
b
E
E1
0. 3 00
0.240
0. 3 10
0.250
0. 3 25
0.2 8 0
4
3
S ide View
e
eA
L
0.100 B S C
0. 3 00 B S C
0.115
4
0.1 3 0
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing M S -001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge G S - 3 .
3 . D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b 3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
R
2 3 25 Orchard Parkway
S an Jose, CA 951 3 1
8P3 , 8 -lead, 0. 3 00" Wide Body, Plastic Dual
In-line Package (PDIP)
8 P 3
B
11
3409G–SEEPR–8/07
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