参数资料
型号: AT86RF212-ZU
厂商: Atmel
文件页数: 118/172页
文件大小: 0K
描述: IC TXRX ZIGBE/802.15.4/ISM 32QFN
产品培训模块: MCU Wireless Solutions Product Line Introduction
标准包装: 2,450
频率: 700MHz,800MHz,900MHz
数据传输率 - 最大: 250kbps
调制或协议: 802.15.4 Zigbee,6LoWPAN,ISM
应用: ISM,ZigBee?
功率 - 输出: 10dBm
灵敏度: -110dBm
电源电压: 1.8 V ~ 3.6 V
电流 - 接收: 9.2mA
电流 - 传输: 25mA
数据接口: PCB,表面贴装
天线连接器: PCB,表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 32-VFQFN 裸露焊盘
包装: 托盘
7.7.2 Integrated Oscillator Setup
Using the internal oscillator, the oscillation frequency depends on the load
between the crystal pins XTAL1 and XTAL2. The total load capacitance
equal to the specified load capacitance of the crystal itself. It consists of
capacitors CX and parasitic capacitances connected to the XTAL nodes.
shows parasitic capacitances, such as PCB stray capacitances.
Figure 7-15. Simplified XOSC Schematic with External Components
capacitance
C L must be
the external
Figure 7-15
C PCB
CX
CX
C PCB
V DD
EVDD
XTAL1
16MHz
XTAL2
PCB
AT86RF212
C TRIM
XTAL_TRIM[3:0]
C TRIM
XTAL_TRIM[3:0]
EVDD
Additional internal trimming capacitors C TRIM are available. Values in the range from
0 pF to 4.5 pF with 0.3 pF resolution are selectable using the bits XTAL_TRIM of
register 0x12 (XOSC_CTRL). To calculate the total load capacitance, the following
formula can be used while C PAR represents the pin input capacitance defined in Table
2-2.
C L = 0.5 · (CX + C TRIM + C PAR + C PCB )
The trimming capacitors provide the possibility of reducing frequency deviations caused
by production process variations or by external components tolerances. Note that the
oscillation frequency can only be reduced by increasing the trimming capacitance. The
frequency deviation caused by one step of C TRIM decreases with increasing crystal load
capacitor values.
An amplitude control circuit is included to ensure stable operation under different
operating conditions and for different crystal types. Enabling the crystal oscillator in
P_ON state and after leaving SLEEP state causes a slightly higher current during the
amplitude build-up phase to guarantee a short start-up time. At stable operation, the
current is reduced to the amount necessary for a robust operation. This also keeps the
drive level of the crystal low.
Generally, crystals with a higher load capacitance are less sensitive to parasitic pulling
effects caused by external component variations or by variations of board and circuit
parasitics. On the other hand, a larger crystal load capacitance results in a longer start-
up time and a higher steady state current consumption.
118
AT86RF212
8168C-MCU Wireless-02/10
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