参数资料
型号: AT91SAM9XE128-QU
厂商: Atmel
文件页数: 150/159页
文件大小: 0K
描述: MCU ARM9 128K FLASH 208-PQFP
产品培训模块: MCU Product Line Introduction
标准包装: 24
系列: SAM9XE
核心处理器: ARM9
芯体尺寸: 16/32-位
速度: 180MHz
连通性: EBI/EMI,以太网,I²C,MMC,SPI,SSC,UART/USART,USB
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 96
程序存储器容量: 128KB(128K x 8)
程序存储器类型: 闪存
RAM 容量: 40K x 8
电压 - 电源 (Vcc/Vdd): 1.65 V ~ 1.95 V
数据转换器: A/D 4x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 208-MQFP,208-PQFP
包装: 托盘
配用: AT91SAM9XE-EK-ND - KIT EVAL FOR AT91SAM9XE
AT91SAM-ICE-ND - EMULATOR FOR AT91 ARM7/ARM9
PIC16F5X
DS41213D-page 78
2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
40
Pitch
e
.100 BSC
Top to Seating Plane
A
.250
Molded Package Thickness
A2
.125
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.590
.625
Molded Package Width
E1
.485
.580
Overall Length
D
1.980
2.095
Tip to Seating Plane
L
.115
.200
Lead Thickness
c
.008
.015
Upper Lead Width
b1
.030
.070
Lower Lead Width
b
.014
.023
Overall Row Spacing §
eB
.700
N
NOTE 1
E1
D
12 3
A
A1
b1
b
e
c
eB
E
L
A2
Microchip Technology Drawing C04-016B
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