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参数资料
| 型号： | B57550G0104F000 |
| 厂商： | EPCOS Inc |
| 文件页数： | 12/19页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR NTC 100K OHM 1% RAD |
| 产品目录绘图： | B57550G0x0xF000 Side |
| 标准包装： | 1,000 |
| 系列： | B57550 |
| 在 25°C 时的电阻（欧姆）： | 100k |
| 电阻公差： | ±1% |
| B 值公差： | ±1% |
| B25/85： | 4066K |
| B25/100： | 4085K |
| 工作温度： | -55°C ~ 200°C |
| 功率 - 最大： | 32mW |
| 长度 - 引线： | 2.80"（71.00mm） |
| 安装类型： | 通孔 |
| 封装/外壳： | 珠，玻璃 |
| 包装： | 散装 |
| 其它名称： | 495-2131 B57550G 104F B57550G104F |
Temperature measurement
Glass-encapsulated sensors
Mounting instructions
B57550G, B57550G1
G550/G1550
1
1.1
Soldering
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
Soldering time
Distance from thermistor
max. 260 ° C
max. 4 s
min. 6 mm
max. 360 ° C
max. 2 s
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
2
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
3
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength:
Test Ua1:
Leads
Please read Cautions and warnings and
Important notes at the end of this document.
0.25 <
0.35 <
0.50 <
0.80 <
? ≤ 0.25 mm = 1.0 N
? ≤ 0.35 mm = 2.5 N
? ≤ 0.50 mm = 5.0 N
? ≤ 0.80 mm = 10.0 N
? ≤ 1.25 mm = 20.0 N
Page 12 of 19
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B57550G0145+ | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Glass-Encapsulated Sensors |
| B57550G0145F000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145F002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
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