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参数资料
| 型号： | B57550G0104F000 |
| 厂商： | EPCOS Inc |
| 文件页数： | 15/19页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR NTC 100K OHM 1% RAD |
| 产品目录绘图： | B57550G0x0xF000 Side |
| 标准包装： | 1,000 |
| 系列： | B57550 |
| 在 25°C 时的电阻（欧姆）： | 100k |
| 电阻公差： | ±1% |
| B 值公差： | ±1% |
| B25/85： | 4066K |
| B25/100： | 4085K |
| 工作温度： | -55°C ~ 200°C |
| 功率 - 最大： | 32mW |
| 长度 - 引线： | 2.80"（71.00mm） |
| 安装类型： | 通孔 |
| 封装/外壳： | 珠，玻璃 |
| 包装： | 散装 |
| 其它名称： | 495-2131 B57550G 104F B57550G104F |
Temperature measurement
Glass-encapsulated sensors
B57550G, B57550G1
G550/G1550
Cautions and warnings General
See "Important notes" at the end of this document.
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature 25 ° C ... +45 ° C, relative
humidity ≤ 75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SO x , Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMDs 12 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180 ° of a lead bent by 90 ° is permissible at 6 mm from the bottom of the
thermistor body.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 19
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B57550G0145+ | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Glass-Encapsulated Sensors |
| B57550G0145F000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145F002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
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