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参数资料
| 型号： | B57550G0104F000 |
| 厂商： | EPCOS Inc |
| 文件页数： | 13/19页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR NTC 100K OHM 1% RAD |
| 产品目录绘图： | B57550G0x0xF000 Side |
| 标准包装： | 1,000 |
| 系列： | B57550 |
| 在 25°C 时的电阻（欧姆）： | 100k |
| 电阻公差： | ±1% |
| B 值公差： | ±1% |
| B25/85： | 4066K |
| B25/100： | 4085K |
| 工作温度： | -55°C ~ 200°C |
| 功率 - 最大： | 32mW |
| 长度 - 引线： | 2.80"（71.00mm） |
| 安装类型： | 通孔 |
| 封装/外壳： | 珠，玻璃 |
| 包装： | 散装 |
| 其它名称： | 495-2131 B57550G 104F B57550G104F |
Temperature measurement
Glass-encapsulated sensors
B57550G, B57550G1
G550/G1550
Bending strength: Test Ub:
Two 90 ° -bends in opposite directions at a weight of 0.25 kg.
Torsional strength: Test Uc: severity 2
The lead is bent by 90 ° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180 ° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180 ° of a lead bent by 90 ° is permissible at 6 mm from the bottom of the
thermistor body.
4
Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
5
Cleaning
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
6
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 19
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相关代理商/技术参数 |
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|---|---|
| B57550G0145+ | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Glass-Encapsulated Sensors |
| B57550G0145F000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145F002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G000 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57550G0145G002 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
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