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| 型号： | BAT54XV2T5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 90K |
| 描述： | DIODE SCHOTTKY DET/SW 30V SOD523 |
| 产品变化通告： | Copper Wire Change 19/May/2010 |
| 标准包装： | 8,000 |
| 二极管类型： | 肖特基 |
| 电压 - (Vr)（最大）： | 30V |
| 电流 - 平均整流 (Io)： | 200mA（DC） |
| 电压 - 在 If 时为正向 (Vf)（最大）： | 800mV @ 100mA |
| 速度： | 小信号 =< 200mA（Io），任意速度 |
| 反向恢复时间(trr)： | 5ns |
| 电流 - 在 Vr 时反向漏电： | 2µA @ 25V |
| 电容@ Vr, F： | 10pF @ 1V，1MHz |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-79，SOD-523 |
| 供应商设备封装： | SOD-523 |
| 包装： | 带卷 (TR) |
BAT54XV2T1G
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD?523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D
?X?
?Y?
2X
b
0.08
M
X
Y
A
HE
c
DIM MIN NOM MAX
MILLIMETERS
D
1.10 1.20 1.30
E
0.70 0.80 0.90
A
0.50 0.60 0.70
b
0.25 0.30 0.35
c
0.07 0.14 0.20
L
0.30 REF
HE
1.50 1.60 1.70
12
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
L2
BOTTOM VIEW
2X
L
2X
0.48
2X
0.40
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2
0.15 0.20 0.25
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81?3?5817?1050
BAT54XV2T1/D
LITERATURE FULFILLMENT:
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303?675?2175 or 800?344?3860 Toll Free USA/Canada
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