- 您现在的位置：买卖IC网 > Datasheet目录843 > BCM352T125M300A00 (Vicor Corporation)HV BCM BUS CONVERT 12.5V 300W Datasheet资料下载
参数资料
| 型号： | BCM352T125M300A00 |
| 厂商： | Vicor Corporation |
| 文件页数： | 1/18页 |
| 文件大小： | 0K |
| 描述： | HV BCM BUS CONVERT 12.5V 300W |
| 应用说明： | Factorized Power Architecture and V-I Chips |
| 产品培训模块： | VI Chip Bus Converter Modules |
| 标准包装： | 1 |
| 系列： | V-I Chip™, BCM™ |
| 类型： | 总线转换器模块 |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 330V |
| 电压 - 输入（最大）： | 365V |
| 输出电压： | 12.5V |
| 电流 - 输出（最大）： | 24A |
| 电源（瓦） - 制造商系列： | 300W |
| 电压 - 隔离： | 4.242kV（4242V） |
| 应用： | 商用 |
| 特点： | 具有远程开/关功能和 UVLO |
| 安装类型： | 通孔 |
| 封装/外壳： | 模块 |
| 尺寸/尺寸： | 1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） |
| 包装： | 托盘 |
| 工作温度： | -55°C ~ 125°C |
| 效率： | 95.3% |
| 电源（瓦特）- 最大： | 300W |
| 重量： | 0.031 磅（14.06g） |
BCM ? Bus Converter
BCM352 x 125 y 300A00
S
C
NRTL
US
Sine Amplitude Converter? (SAC?)
FEATURES
? 352 Vdc – 12.5 Vdc 300 W Bus Converter
? High efficiency (>95%) reduces system power
consumption
? High power density (>1000 W/in 3 )
reduces power system footprint by >40%
? “Full Chip” VI Chip ? package enables surface mount,
low impedance interconnect to system board
? Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
? Provides enable/disable control, internal temperature
monitoring
? ZVS/ZCS Resonant Sine Amplitude Converter topology
? Can be paralleled to create multi-kW arrays
DESCRIPTION
The VI Chip ? bus converter is a high efficiency (>95%) Sine Am-
plitude Converter? (SAC?) operating from a 330 to 365 Vdc
primary bus to deliver an isolated 11.79 – 13.04 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators,
meaning that input capacitance normally located at the input
of a regulator can be located at the input to the SAC. Since the
K factor of the BCM352F125T300A00 is 1/28, that capacitance
value can be reduced by a factor of 784x, resulting in savings of
board area, materials and total system cost.
The BCM352F125T300A00 is provided in a VI Chip package
compatible with standard pick-and-place and surface mount
assembly processes. The VI Chip package provides flexible ther-
mal management through its low junction-to-case and junc-
tion-to-board thermal resistance. With high conversion
efficiency the BCM352F125T300A00 increases overall system
efficiency and lowers operating costs compared to
conventional approaches.
TYPICAL APPLICATIONS
? High End Computing Systems
? Automated Test Equipment
? High Density Power Supplies
V IN = 330 – 365 V
V OUT = 11.79 – 13.04 V ( NO LOAD )
PART NUMBERING
P OUT = 300 W( NOM )
K = 1/28
PART NUMBER
BCM 352 x 125 T 300A00
PACKAGE STYLE
F = J-Lead
T = Through hole
PRODUCT GRADE
T = -40° to 125 °C
For Storage and Operating Temperatures see Section 6.0 General Characteristics
TYPICAL APPLICATION
enable / disable
switch
SW1
PC
TM
BCM ?
POL
POL
F1
+In
+Out
POL
V IN
C1
1 μF
V OUT
POL
(8)
-In
-Out
BCM ? Bus Converter
Page 1 of 18
Rev 1.7
1/2013
vicorpower.com
800 735.6200
相关PDF资料 |
PDF描述 |
|---|---|
| BCM352T440T330A00 | HV BCM BUS CONVERT 44V 325W |
| BCM384F480T325A00 | CONVERTER BUS BCM 48V 325W SMD |
| BCM48BH120M120A00 | HALF-CHIP BCM BUS CONVERTER |
| BCM48BT030M210A00 | V.I CHIP BCM BUS CONVERTER |
| BCM48BT040M200A00 | BCM BUS CONVERTER 4V 200W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BCM352T125T300A00 | 功能描述:HV BCM BUS CONVERT 12.5V 300W RoHS:是 类别:电源 - 板载 >> DC DC 转换器（分解式） 系列:V-I Chip™, BCM™ 应用说明:Factorized Power Architecture and V-I Chips 产品培训模块:VI Chip Bus Converter Modules 标准包装:1 系列:V-I Chip™, BCM™ 类型:总线转换器模块 输出数:1 电压 - 输入（最小）:330V 电压 - 输入（最大）:365V 输出电压:12.5V 电流 - 输出（最大）:24A 电源（瓦） - 制造商系列:300W 电压 - 隔离:4.242kV（4242V） 应用:商用 特点:具有远程开/关功能和 UVLO 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） 包装:托盘 工作温度:-55°C ~ 125°C 效率:95.3% 电源（瓦特）- 最大:300W 重量:0.031 磅（14.06g） |
| BCM352T440T330A00 | 功能描述:HV BCM BUS CONVERT 44V 325W RoHS:是 类别:电源 - 板载 >> DC DC 转换器（分解式） 系列:V-I Chip™, BCM™ 应用说明:Factorized Power Architecture and V-I Chips 产品培训模块:VI Chip Bus Converter Modules 标准包装:1 系列:V-I Chip™, BCM™ 类型:总线转换器模块 输出数:1 电压 - 输入（最小）:330V 电压 - 输入（最大）:365V 输出电压:12.5V 电流 - 输出（最大）:24A 电源（瓦） - 制造商系列:300W 电压 - 隔离:4.242kV（4242V） 应用:商用 特点:具有远程开/关功能和 UVLO 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） 包装:托盘 工作温度:-55°C ~ 125°C 效率:95.3% 电源（瓦特）- 最大:300W 重量:0.031 磅（14.06g） |
| BCM3560 | 制造商:BOARDCOM 制造商全称:Broadcom Corporation. 功能描述:DIGITAL TV SYSTEM-ON-CHIP |
| BCM3714KSA01 | 功能描述:3714+53125M CHIPSET FOR KT 制造商:broadcom limited 系列:* 零件状态:在售 标准包装:1 |
| BCM3715SI01 | 功能描述:1-PORT GBE SFU CHIPSET 制造商:broadcom limited 系列:* 零件状态:在售 标准包装:1 |
发布紧急采购，3分钟左右您将得到回复。