参数资料
型号: BD00C0AWFP-E2
厂商: Rohm Semiconductor
文件页数: 13/21页
文件大小: 0K
描述: IC REG LDO ADJ 1A TO252-5
标准包装: 2,000
稳压器拓扑结构: 正,可调式
输出电压: 3 V ~ 15 V
输入电压: 4 V ~ 25 V
电压 - 压降(标准): 0.3V @ 500mA
稳压器数量: 1
电流 - 输出: 1A(最小值)
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: TO-252-5,DPak(4 引线 + 接片),TO-252AD
供应商设备封装: *
包装: 带卷 (TR)
BD00C0AWxx series
Datasheet
11. Output pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1 μ F. Electrolytic, tantalum and ceramic capacitors can be used. When
selecting the capacitor ensure that the capacitance of more than 1 μ F is maintained at the intended applied voltage and
temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For
selection of the capacitor refer to the Cout ESR vs. I O . The stable operation range given in the reference data is based on
the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB
impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is
needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets with the required specification.
100
4.0V ≤ V CC ≤ 26.5V
-40 ℃ ≤ Ta ≤ +105 ℃
5k ? ≤ R 1 ≤ 10k ?
2.2μF ≤ Cin ≤ 100μF
1μF ≤ Cout ≤ 100μF
3.0V ≤ V O ≤ 15.0V
100
4.0V ≤ V CC ≤ 26.5V
-40 ℃ ≤ Ta ≤ +105 ℃
5k ? ≤ R 1 ≤ 10k ?
3.0V ≤ V O ≤ 15.0V
0A ≤ I O ≤ 1A
6.0V ≤ V CC ≤ 26.5V
-40 ℃ ≤ Ta ≤ +105 ℃
5k ? ≤ R 1 ≤ 10k ?
100
5.0V ≤ V O ≤ 15.0V
0A ≤ I O ≤ 1A
Unstable operating region
10
1
Stable operating region
10
Stable operating region
10
Stable operating region
0.1
0.01
2.2
Unstable
operating region
0.001
1
1
0
200
400
600
800
1000
1
10
100
1
10
100
Io(mA)
Cout_ESR vs. I O (reference data)
Vcc
(4.0V to 26.5V)
Cin
(1μF or higher)
Vcc
Cout ( μF )
Cin vs. Cout(reference data)
Cout
(1μF or higher)
ESR
(0.001 Ω or higher)
Vo
R 2
Cout(μF)
V CTL
(5.0V)
CTL
GND
ADJ
R 1
(5k to 10k Ω )
Io
(Rout)
※ Operation Note 11 Measurement circuit
12. CTL pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
13. Rapid variation in V CC voltage and load current
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current
and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
14. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
15. Over current protection circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
16. Thermal shutdown circuit (TSD)
This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should
be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
www.rohm.com
? 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
13/18
TSZ02201-0T2T0AZ00060-1-2
08.Feb.2013 Rev.001
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