参数资料
| 型号： | BD00D0AWHFP-TR |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 2A HRP5 |
| 标准包装： | 2,000 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 3 V ~ 15 V |
| 输入电压： | 4 V ~ 25 V |
| 电压 - 压降（标准）： | 0.4V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 2A（最小值） |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | HRP-5 |
| 供应商设备封装： | HRP-5 |
| 包装： | 带卷 (TR) |
BD00D0AWHFP
● Thermal Design
Technical Note
10
Mounted on a Rohm standard board
Board size : 70 ㎜× 70 ㎜× 1.6 ㎜
10
Mounted on a Rohm standard board
Board size : 70 ㎜× 70 ㎜× 1.6 ㎜
(board contains a thermal)
① 2-layer board
8
θ ja=78.1( ℃ /W)
8
③ 7.3W
(back surface copper foil area :15 ㎜× 15 ㎜ )
② 2-layer board
(back surface copper foil area :70 ㎜× 70 ㎜ )
③ 4-layer board
(back surface copper foil area :70 ㎜× 70 ㎜ )
6
6
② 5.5W
① : θ ja=54.3 ℃ /W
② : θ ja=22.7 ℃ /W
③ : θ ja=17.1 ℃ /W
4
2
0
1.6W
4
2
0
① 2.3W
0
25
50 75 100 125
150
0
25
50 75 100 125
150
Temperature atmosphere Ta( ℃ )
Fig.15
Temperature atmosphere Ta( ℃ )
Fig.16 (Reference data)
When using at temperatures over Ta=25 ℃ , please refer to the heat reducing characteristics shown in Fig.15. and Fig.16.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC
at temperatures less than the maximum junction temperature Tjmax.
Fig.15 and Fig.16 shows the acceptable loss and heat reducing characteristics of the HRP5 package. Even when the
ambient temperature Ta is a normal temperature (25 ℃ ), the chip (junction) temperature Tj may be quite high so please
operate the IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :(Fig.16 ③ )
Pc=(Vcc － Vo) × Io+Vcc × Ib
Acceptable loss Pd ≧ Pc
Solving this for load current Io in order to operate within the acceptable loss,
Vcc:
Vo:
Io:
Ib:
Ishort:
Input voltage
Output voltage
Load current
Circuit current
Short current
Io ≦
Pd － Vcc × Ib
Vcc － Vo
(Please refer to Fig.9 for Ib.)
It is then possible to find the maximum load current Io Max with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example)When Ta=85 ℃ ,Vcc=10V,Vo=5V
Io ≦
3.796 － 10 × Ib
5
Fig.16 ③ : θ ja=17.1 ℃ /W → -58.4mW/ ℃
25 ℃ =7.3W → 85 ℃ =3.796W
Io ≦ 758.2mA
(Ib:0.5mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc × (Ib+Ishort)
(Please refer to Fig. 5 for Ishort)
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
7/11
2011.03 - Rev.A
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