参数资料
| 型号： | BD00D0AWHFP-TR |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 9/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 2A HRP5 |
| 标准包装： | 2,000 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 3 V ~ 15 V |
| 输入电压： | 4 V ~ 25 V |
| 电压 - 压降（标准）： | 0.4V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 2A（最小值） |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | HRP-5 |
| 供应商设备封装： | HRP-5 |
| 包装： | 带卷 (TR) |
BD00D0AWHFP
Technical Note
10. Output pin
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable
capacitance values range from 2.2μF to 1000μF. Ceramic capacitors can be used as long as their ESR value is low
enough to prevent oscillation (0.001 ? to 20 ? ). Abrupt fluctuations in input voltage and load conditions may affect the
output voltage.
Vcc ＝ 4V ～ 25V
Vo ＝ 3V ～ 15V
Vcc ＝ 4V ～ 25V
Vo ＝ 3V ～ 15V
100
10
Ta ＝ -40 ℃～ +105 ℃
R1 ＝ 5k Ω～ 10k Ω
Cin ＝ 2.2μF ～ 100μF Cout ＝ 2.2μF ～ 100μF
Unstable operating region
100
Ta ＝ -40 ℃～ +105 ℃
R1 ＝ 5k Ω～ 10k Ω
Io ＝ 0A ～ 2A
1
Stable operating region
10
Stable operating region
0.1
0.01
1
0.001
1
2.2
10
100
0
400
800
1200
1600
2000
Cout（μF）
Io(mA)
Cout_ESR vs Io(reference data)
Vcc
Vcc
Vo
Cin vs Cout(reference data)
Cout(2.2μF ～ )
ESR (0.001 ? ～ )
R2
(4 ～ 25V)
Cin
(2.2μF ～ )
CTL
V CTL
(5V)
GND
ADJ
R1
(5k ～ 10k ? )
Io(ROUT)
※ Operation Notes 10 Measurement circuit
11. CTL pin
Do not make voltage level of chip enable pin keep floating level, or in between VthH and VthL. Otherwise, the output
voltage would be unstable or indefinite.
12. For a steep change of the Vcc voltage
Because MOS FET for output Transistor is used when an input voltage change is very steep, it may evoke large current.
When selecting the value of external circuit constants, please make sure that the operation on the actual application takes
these conditions into account.
13. For an infinitesimal fluctuations of output voltage.
At the use of the application that infinitesimal fluctuations of output voltage caused by some factors (e.g. disturbance noise,
input voltage
fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert the
filter, etc.).
14. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity.
This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current
(without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These
protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should
not be used in applications characterized by the continuous or transitive operation of the protection circuits.
15. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after
this function has activated, or in applications where the operation of this circuit is assumed.
16. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000μF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
9/11
2011.03 - Rev.A
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