参数资料
| 型号： | BD4153FV-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 12/20页 |
| 文件大小： | 0K |
| 描述： | IC PWR MGMT SWITCH 24SSOP |
| 标准包装： | 2,000 |
| 应用： | LDO（线性），带复位功能 |
| 输入电压： | 4.5 V ~ 5.5 V |
| 输出数： | 2 |
| 输出电压： | 3.3V，可调 |
| 工作温度： | -30°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 24-SSOP |
| 包装： | 带卷 (TR) |
BD4153FV,BD4153EFV
● Apprication Circuit (Circuit for ExpressCard TM Compliance Checklist)
BD4153FV
Technical Note
CPPE#(1)
CPPE#(11pin)
VCC(24pin)
CPUSB#(2)
3.3V(3)
3.3Vaux(4)
1.5V(5)
PERST#(6)
CPUSB#(12pin)
V3(3,4pin)
V3AUX(5pin)
V15(8,9pin)
PERST#(19pin)
V3_IN(21,22pin)
V3AUX_IN(20pin)
V15_IN(17,18pin)
PERST_IN#(7pin)
EN(23pin)
3.3V(7)
3.3Vaux(8)
1.5V(9)
SysReset#(10)
VCC
OC(15pin)
OC_Delay(14pin)
SYSR(10pin)
SS_V3(2pin)
SS_V3AUX(6pin)
PERST#_Delay(13pin)
SS_V15(16pin)
GND(1pin)
● About heat loss
In designing heat, operate the apparatus within the following conditions.
(Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.)
1. Ambient temperature Ta shall be not more than 125°C.
2. Chip junction temperature Tj shall be not more than 150°C.
Chip junction temperature Tj can be considered under the following two cases.
① Chip junction temperature Tj is found from IC surface temperature TC under actual application conditions:Tj=TC+ θ j-c×W
＜ Reference value ＞
θ j-c:SSOP-B24 33 ℃ /W
HTSSOP-B24 36 ℃ /W
② Chip junction temperature Tj is found from ambient temperature Ta:Tj=TC+ θ j-a×W
＜ Reference value ＞
(substrate surface copper foil area:15×15mm )
(substrate surface copper foil area: 70×70mm )
(substrate surface copper foil area: 70×70mm )
θ j-a:SSOP-B24 243.9 ℃ /W
147.1 ℃ /W
θ j-a:HTSSOP-B24 113.6 ℃ /W
73.5 ℃ /W
44.6 ℃ /W
31.3 ℃ /W
(IC only)
Single-layer substrate
(substrate surface copper foil area: less 3%)
Single-layer substrate
(substrate surface copper foil area: less 3%)
Double-layer substrate
Double-layer substrate
Fourth-layer substrate
2
2
2
Most of heat loss in BD4153FV occurs at the output switch. The power lost is determined by multiplying the on-resistance
by the square of output current of each switch. As BD4153EFV employs the power PKG, the thermal derating
characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc
board to be used.
www.rohm.com
? 2010 ROHM Co., Ltd. All rights reserved.
12/17
2010.04 - Rev.B
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD4154FV | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCardTM |
| BD4154FV_09 | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCardTM |
| BD4154FV_10 | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCard |
| BD4154FV-E2 | 功能描述:热插拔功率分布 POWER SWITCH IC EXPRESSCARD RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| BD4155FV | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCard |
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