参数资料
| 型号： | BD4153FV-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC PWR MGMT SWITCH 24SSOP |
| 标准包装： | 2,000 |
| 应用： | LDO（线性），带复位功能 |
| 输入电压： | 4.5 V ~ 5.5 V |
| 输出数： | 2 |
| 输出电压： | 3.3V，可调 |
| 工作温度： | -30°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 24-SSOP |
| 包装： | 带卷 (TR) |
BD4153FV,BD4153EFV
Technical Note
10. GND wiring pattern
If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current
GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at
the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for
GND wiring pattern of component externally connected, pay special attention not to cause undesirable change to it.
11. Electrical characteristics
The electrical characteristics in the Specifications may vary depending on ambient temperature, power supply voltage,
circuit(s) externally applied, and/or other conditions. It is therefore requested to carefully check them including transient
characteristics.
12. Capacitors to be applied to the input terminals
The capacitors to be applied to the input terminals (VCC, V3_IN, V3AUX_IN and V15_IN) are used to lower the output
impedance of the power supply to be connected. An increase in the output impedance of the power supply may result in
destabilization of input voltages (VCC, V3_IN, V3AUX_IN and V15_IN). It is recommended to use a low ESR capacitor
with less temperature coefficient (change in capacitance vs. change in temperature), 0.1 μ F more or less for VCC and
V3AUX_IN while 1 μ F more or less for V3_IN and V15_IN, but it must be thoroughly checked at the temperature and with
the load of the range expected to use because it significantly depends on the characteristics of the input power supply to
be used and the conductor pattern of the pc board.
13. Capacitors to be applied to the output terminals
To the output terminals (V3, V3_AUX, and V15), the output capacitors should be connected between the respective output
terminal and GND. It is recommended to use a low ESR capacitor with less temperature coefficient, 1 μ F more or less for
V3 and V15 terminals while 1 μ F more or less for V3_AUX, but it must be thoroughly checked at the temperature and with
the load of the range expected to use because it significantly depends on the temperature and the load conditions.
14. Not of a radiation-resistant design.
15. . Allowable loss Pd
With respect to the allowable loss, the thermal derating characteristics are shown in the Exhibit, which we hope would be
used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the allowable loss, reduction of current
capacity due to chip temperature rise, and other degraded properties inherent to the IC would result. You are strongly
urged to use the IC within the allowable loss.
16. In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
OUTPUT PIN
17. Operating ranges
If it is within the operating ranges, certain circuit functions and operations are warranted in the working ambient
temperature range. With respect to characteristic values, it is unable to warrant standard values of electric
characteristics but there are no sudden variations in characteristic values within these ranges.
18. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm
the characteristics before using the IC.In addition, when the IC is used with the external circuit changed, decide the IC with
sufficient margin providedwhile consideration is being given not only to static characteristics but also variations of external
parts and our IC including transient
19. Wiring to the input terminals (V3 IN, V3AUX IN, and V15 IN) and output terminals (V3, V3AUX and V15) of built-in FET
should be carried out with special care. Unnecessarily long and/or thin conductors used in wiring may result in
degradation of characteristics including decrease in output voltage.
20. Heatsink
Heatsink is connected to SUB, which should be short-circuited to GND. Solder the heatsink to a pc board properly, which
offers lower thermal resistance.
www.rohm.com
? 2010 ROHM Co., Ltd. All rights reserved.
15/17
2010.04 - Rev.B
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD4154FV | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCardTM |
| BD4154FV_09 | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCardTM |
| BD4154FV_10 | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCard |
| BD4154FV-E2 | 功能描述:热插拔功率分布 POWER SWITCH IC EXPRESSCARD RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| BD4155FV | 制造商:ROHM 制造商全称:Rohm 功能描述:Power Switch IC for ExpressCard |
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