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参数资料
| 型号： | BD6226FP-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 15/22页 |
| 文件大小： | 0K |
| 描述： | IC H-BRIDGE DRIVER 2CH 1A HSOP25 |
| 特色产品： | H-Bridge Driver IC |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器 |
| 输出数： | 2 |
| 电流 - 输出： | 1A |
| 电源电压： | 6 V ~ 15 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 25-SOP（0.213"，5.40mm）+ 2 翼片 |
| 供应商设备封装： | 25-HSOP |
| 包装： | 标准包装 |
| 产品目录页面： | 1372 (CN2011-ZH PDF) |
| 其它名称： | BD6226FP-E2DKR |
BD622xxx Series
● Operational Notes
Datasheet
1)
2)
Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
3) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4)
5)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc ≥ Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax － Ta)/ θ ja
: Pc (W)=(Vcc － Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150 ℃ , Ta : Peripheral temperature[ ℃ ] ,
θ ja : Thermal resistance of package-ambience[ ℃ /W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a
wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles
caught between the pins.
7)
8)
9)
10)
11)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
Capacitor between output and GND
If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow into
the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a
capacitor smaller than 10uF between output and GND.
Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
Switching noise
When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins
and cause IC malfunctions. In this case, insert a pull down resistor (10k ? is recommended) between each control input
pin and ground.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
15/19
TSZ02201-0P2P0B300080-1-2
25.Dec.2012 Rev.002
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相关代理商/技术参数 |
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|---|---|
| BD6227 | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge drivers (18V max.) |
| BD622X-E | 制造商:ROHM 制造商全称:Rohm 功能描述:DC Brush Motor Drivers (18V max.) |
| BD6230 | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge drivers (36V max.) |
| BD6230_09 | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge drivers (36V max.) |
| BD6230F | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge driver for DC brush motor |
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