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参数资料
| 型号： | BD7851FP-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 11/18页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER LINEAR 25-HSOP |
| 标准包装： | 1 |
| 恒定电流： | 是 |
| 拓扑： | 线性 |
| 输出数： | 16 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 通用 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 输出电压： | 10V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 25-SOP（0.213"，5.40mm）+ 2 翼片 |
| 供应商设备封装： | 25-HSOP |
| 包装： | 标准包装 |
| 工作温度： | -30°C ~ 85°C |
| 产品目录页面： | 1372 (CN2011-ZH PDF) |
| 其它名称： | BD7851FP-E2DKR |
BU2050F,BU2092F,BU2092FV,BU2099FV,BD7851FP,BU2152FS
Technical Note
2/24
www.rohm.com
2009.06 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
●Thermal derating curve
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Limits
Unit
BU2050F
BU2092F
BU2092FV
Power Supply Voltage
VDD
-0.3 to +7.0
V
Power dissipation 1
Pd1
450 *
1
450 (SOP) *
2
400 (SSOPB) *
3
mW
Power dissipation 2
Pd2
-
550 (SOP) *
4
650 (SSOPB) *
5
mW
Input Voltage
VIN
VSS-0.3 to VDD+0.5
VSS-0.3 to VDD+0.3
V
Output Voltage
Vo
VSS-0.3 to VDD+0.5
VSS to +25.0
V
Operating Temperature
Topr
-40 to +85
-25 to +75
℃
Storage Temperature
Tstg
-55 to +125
℃
*1 Reduced by 4.5mW/℃ over 25℃
*2 Reduced by 4.5mW/℃ over 25℃
*3 Reduced by 4.0mW/℃ over 25℃
*4 Reduced by 5.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 50mm×50mm×1.6mm Glass-epoxy PCB).
*5 Reduced by 6.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
Parameter
Symbol
Limits
Unit
BU2099FV
BD7851FP
BU2152FS
Power Supply Voltage
VDD
-0.3 to +7.0
0 to +7.0
-0.3 to +7.0
V
Power dissipation 1
Pd1
400 (SSOPB) *
6
1450 *
7
800 *
8
mW
Power dissipation 2
Pd2
650 (SSOPB) *
9
-
mW
Input Voltage
VIN
VSS-0.3 to VDD+0.3
-0.3 to VCC+0.3
VSS-0.3 to VDD+0.3
V
Output Voltage
Vo
VSS to +25.0
0 to +10
VSS-0.3 to VDD+0.3
V
Operating Temperature
Topr
-40 to +85
-30 to +85
-25 to +85
℃
Storage Temperature
Tstg
-55 to +125
-55 to +150
-55 to +125
℃
*6 Reduced by 4.5mW/℃ over 25℃
*7 Reduced by 11.6mW/℃ over 25℃
*8 Reduced by 8.0mW/℃ over 25℃
*9 Reduced by 6.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
700
600
500
400
300
200
100
0
25
50
75
100
125
150
175
Ambient temperature
Ta [℃]
Power
dissi
p
a
tio
n
Pd
[m
W
]
BU2099FV
85℃
BU2050F
25
50
75
100
125
150
175
Ambient temperature
Ta [℃]
Power
dissi
p
a
tio
n
Pd
[m
W
]
85℃
400
200
0
800
600
1200
1000
1600
1400
BU2152FS
BD7851FP
700
600
500
400
300
200
100
0
25
50
75
100
125
150
175
Ambient temperature
Ta [℃]
Power
dissi
p
a
tio
n
Pd
[m
W
]
BU2092FV
BU2092F
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