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| 型号： | BD9007HFP |
| 元件分类： | 稳压器 |
| 英文描述： | 2 A SWITCHING REGULATOR, 505 kHz SWITCHING FREQ-MAX, PSSO7 |
| 封装： | ROHS COMPLIANT, HRP-7 |
| 文件页数： | 6/18页 |
| 文件大小： | 484K |
| 代理商： | BD9007HFP |
BD9006F, BD9006HFP, BD9007F, BD9007HFP
Technical Note
14/17
www.rohm.com
2009.05 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
<Reference>
Measurement of open loop of the DC/DC converter
To measure the open loop of the DC/DC converter, use the gain phase
analyzer or FRA to measure the frequency characteristics.
<Procedure>
1. Check to ensure output causes no oscillation at the maximum
load inclosed loop.
2. Isolate ① and ②and insert Vm
(with amplitude of approximately.100mVpp).
3. Measure (probe) the oscillation of ① to that of ②.
※
Please contact us if you have any questions regarding phase compensation.
●
Heat Loss
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperature, take margin into account.)
1. The ambient temperature Ta is to be 105℃ or less.
2. The chip junction temperature Tj is to be 150℃ or less.
The chip junction temperature Tj can be considered in the following two patterns:
To obtain Tj from the IC surface temperature TC in actual use state, Tj=Ta+θj－a×W
< Reference value > θj－c :HRP7
7℃/W
SOP8 32.5℃/W
To obtain Tj from the ambient temperature Ta in actual use state,Tj=TC+θj－c×W
< Reference. value >
θj－a :
HRP7 89.3℃/W Single piece of IC
54.3℃/W 2-layer PCB (Copper foil area on the front side of PCB: 15×15mm
2)
22.7℃/W 2-layer PCB (Copper foil area on the front side of PCB: 70×70mm
2)
PCB size: 70×70×1.6mm
3 (PCB incorporates thermal via.)
Copper foil area on the front side of PCB: 10.5×10.5mm
2
θj－a :
SOP8 222.2℃/W Single piece of IC
181.8℃/W 1-layer PCB
PCB size: 70×70×1.6mm
3
The heat loss W of the IC can be obtained by the formula shown below:
W = Ron × Io
2 ×
Vo
+ VIN × Icc + Tr × VIN × Io × f
VIN
Ron: ON resistance of IC (refer to page.4)
Io: Load current
Vo: Output voltage
VIN: Input voltage ICC: Circuit current (refer to page.3)
Tr: Switching rise/fall time (approximately 20nsec)
f: Oscillation frequency
Furthermore, the phase margin can also be measured with the load
responsiveness. Measure variations in the output voltage when
instantaneously changing the load from no load to the maximum load. Even
though ringing phenomenon is caused, due to low phase margin, no ringing
takes place. Phase margin is provided. However, no specific phase margin
can be probed.
①
Ron × Io
2
②
2×
2
1
× Tr ×
T
1
× VIN ×Io
=Tr ×VIN × Io× f
GND
SW wave from
VIN
Tr
1
2
T=
1
f
Inadequate phase margin
Adequate phase margin
0
Load
Maximum load
Output
voltage
t
0
RL
DC/DC converter
controller
+
VO
①
②
①
②
Vm
+
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相关代理商/技术参数 |
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|---|---|
| BD9007HFP-TR | 功能描述:开关变换器、稳压器与控制器 Flexible Step-Down RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| BD9009HFP | 制造商:ROHM 制造商全称:Rohm 功能描述:Silicon Monolithic Integrated Circuit |
| BD9009HFP-TR | 功能描述:IC REG BUCK ADJ 4A HRP7 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON（1.45x1） 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2 |
| BD900A | 功能描述:达林顿晶体管 70W PNP Silicon RoHS:否 制造商:Texas Instruments 配置:Octal 晶体管极性:NPN 集电极—发射极最大电压 VCEO:50 V 发射极 - 基极电压 VEBO: 集电极—基极电压 VCBO: 最大直流电集电极电流:0.5 A 最大集电极截止电流: 功率耗散: 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-18 封装:Reel |
| BD900A-S | 功能描述:达林顿晶体管 80V 8A PNP RoHS:否 制造商:Texas Instruments 配置:Octal 晶体管极性:NPN 集电极—发射极最大电压 VCEO:50 V 发射极 - 基极电压 VEBO: 集电极—基极电压 VCBO: 最大直流电集电极电流:0.5 A 最大集电极截止电流: 功率耗散: 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-18 封装:Reel |
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