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| 型号： | BD9007HFP |
| 元件分类： | 稳压器 |
| 英文描述： | 2 A SWITCHING REGULATOR, 505 kHz SWITCHING FREQ-MAX, PSSO7 |
| 封装： | ROHS COMPLIANT, HRP-7 |
| 文件页数： | 8/18页 |
| 文件大小： | 484K |
| 代理商： | BD9007HFP |
BD9006F, BD9006HFP, BD9007F, BD9007HFP
Technical Note
16/17
www.rohm.com
2009.05 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
8. GND wiring pattern
It is recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single
ground at the reference point of the set PCB, so that resistance to the wiring pattern and voltage fluctuations due to a
large current will cause on fluctuations in voltages of the small-signal GND. Prevent fluctuations in the GND wiring pattern
of external parts.
9. Temperature protection (thermal shut down) circuit
This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above, be
sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range continue,
the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output power element.
Then, when the tip temperature Tj falls, the circuit will be automatically reset. Furthermore, if the temperature protection
circuit is activated under the condition exceeding the absolute maximum ratings, do not attempt to use the temperature
protection circuit for set design.
10. On the application shown below, if there is a mode in which VIN and each pin potential are inverted, for example, if the
VIN is short-circuited to the Ground with external diode charged, internal circuits may be damaged. To avoid damage, it is
recommended to insert a backflow prevention diode in the series with VIN or a bypass diode between each pin and VIN.
Fig.30
●
Thermal reduction characteristics
HRP7
SOP8
①
Single piece of IC
①
Single piece of IC
PCB Size: 70×70×1.6mm
3
(PCB incorporates thermal via)
②
When mounted on ROHM standard PCB
Copper foil area on the front side of PCB: 10.5×10.5mm
2
(Glass epoxy PCB of 70mm×70mm×1.6mm)
②
2-layer PCB (Copper foil area on the reverse side of PCB: 15×15mm2)
③
2-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)
④
4-layer PCB (Copper foil area on the reverse side of PCB: 70×70mm2)
Fig.31
Fig.32
Backflow prevention diode
Vcc
Pin
Bypass diode
8
10
④
7.3W
③
5.5W
9
7
6
5
4
3
2
1
0
②
2.3W
PO
WER
DISSIP
A
TION
：
PD
[W]
AMBIENT TEMPERATURE：Ta [℃]
25
50
75
100
125
150
①
1.4W
0.8
②
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
PO
WER
DISSIP
A
TION
：
PD
[W]
AMBIENT TEMPERATURE：Ta [℃]
25
50
75
100
125
150
①
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD9007HFP-TR | 功能描述:开关变换器、稳压器与控制器 Flexible Step-Down RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| BD9009HFP | 制造商:ROHM 制造商全称:Rohm 功能描述:Silicon Monolithic Integrated Circuit |
| BD9009HFP-TR | 功能描述:IC REG BUCK ADJ 4A HRP7 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON（1.45x1） 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2 |
| BD900A | 功能描述:达林顿晶体管 70W PNP Silicon RoHS:否 制造商:Texas Instruments 配置:Octal 晶体管极性:NPN 集电极—发射极最大电压 VCEO:50 V 发射极 - 基极电压 VEBO: 集电极—基极电压 VCBO: 最大直流电集电极电流:0.5 A 最大集电极截止电流: 功率耗散: 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-18 封装:Reel |
| BD900A-S | 功能描述:达林顿晶体管 80V 8A PNP RoHS:否 制造商:Texas Instruments 配置:Octal 晶体管极性:NPN 集电极—发射极最大电压 VCEO:50 V 发射极 - 基极电压 VEBO: 集电极—基极电压 VCBO: 最大直流电集电极电流:0.5 A 最大集电极截止电流: 功率耗散: 最大工作温度:+ 150 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-18 封装:Reel |
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