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参数资料
型号： BX80546PG2800E
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 2800 MHz, MICROPROCESSOR, CPGA478
封装： 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478
文件页数： 33/80页
文件大小： 1845K
代理商： BX80546PG2800E
4
Datasheet
5.2.2
On-Demand Mode.................................................................................. 68
5.2.3
PROCHOT# Signal Pin .......................................................................... 68
5.2.4
THERMTRIP# Signal Pin ....................................................................... 69
5.2.5
Tcontrol and Fan Speed Reduction.......................................................... 69
5.2.6
Thermal Diode........................................................................................ 69
6Features ....................................................................................................................... 71
6.1
Power-On Configuration Options ........................................................................ 71
6.2
Clock Control and Low Power States.................................................................. 72
6.2.1
Normal State—State 1 ........................................................................... 72
6.2.2
AutoHALT Powerdown State—State 2 .................................................. 72
6.2.3
Stop-Grant State—State 3 ..................................................................... 73
6.2.4
HALT/Grant Snoop State—State 4 ........................................................ 73
6.2.5
Sleep State—State 5.............................................................................. 74
7
Boxed Processor Specifications ....................................................................... 75
7.1
Mechanical Specifications ................................................................................... 76
7.1.1
Boxed Processor Cooling Solution Dimensions ..................................... 76
7.1.2
Boxed Processor Fan Heatsink Weight.................................................. 77
7.1.3
Boxed Processor Retention Mechanism and Heatsink Attach
Clip Assembly ........................................................................................ 78
7.2
Electrical Requirements ...................................................................................... 78
7.2.1
Fan Heatsink Power Supply ................................................................... 78
7.3
Thermal Specifications ........................................................................................ 79
7.3.1
Boxed Processor Cooling Requirements ............................................... 79
7.3.2
Variable Speed Fan ............................................................................... 81
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