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参数资料
型号： BX80546PG2800E
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 2800 MHz, MICROPROCESSOR, CPGA478
封装： 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478
文件页数： 55/80页
文件大小： 1845K
代理商： BX80546PG2800E
6
Datasheet
Tables
1
References .......................................................................................................... 11
2
Core Frequency to FSB Multiplier Configuration................................................. 14
3
Voltage Identification Definition ........................................................................... 15
4
FSB Pin Groups .................................................................................................. 18
5
Signal Characteristics ......................................................................................... 19
6
Signal Reference Voltages.................................................................................. 19
7
BSEL[1:0] Frequency Table for BCLK[1:0] ......................................................... 20
8
Processor DC Absolute Maximum Ratings ......................................................... 21
9
Voltage and Current Specifications ..................................................................... 22
10
VCC Static and Transient Tolerance for Loadline A............................................. 23
11
VCC Static and Transient Tolerance for Loadline B............................................. 25
12
GTL+ Signal Group DC Specifications................................................................ 27
13
Asynchronous GTL+ Signal Group DC Specifications ........................................ 27
14
PWRGOOD and TAP Signal Group DC Specifications ...................................... 28
15
VCCVID DC Specifications ................................................................................. 28
16
VIDPWRGD DC Specifications ........................................................................... 28
17
BSEL [1:0] and VID[5:0] DC Specifications......................................................... 29
18
BOOTSELECT DC Specifications....................................................................... 29
19
VCC Overshoot Specifications ............................................................................. 29
20
Processor Loading Specifications ....................................................................... 35
21
Package Handling Guidelines ............................................................................. 35
22
Processor Materials ............................................................................................ 36
23
Alphabetical Pin Assignment............................................................................... 42
24
Numerical Pin Assignment .................................................................................. 48
25
Signal Description ............................................................................................... 54
26
Processor Thermal Specifications....................................................................... 64
27
Thermal Profile .................................................................................................... 65
28
Thermal Diode Parameters ................................................................................. 70
29
Thermal Diode Interface...................................................................................... 70
30
Power-On Configuration Option Pins .................................................................. 71
31
Fan Heatsink Power and Signal Specifications................................................... 79
32
Boxed Processor Fan Heatsink Set Points ......................................................... 81
.
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