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参数资料
| 型号： | BX80547RE2533CN |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 7/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE2533CN |
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Datasheet
15
Electrical Specifications
2
Electrical Specifications
This chapter describes the electrical characteristics of the processor interfaces and signals. DC
electrical characteristics are provided.
2.1
FSB and GTLREF
Most processor FSB signals use Gunning Transceiver Logic (GTL+) signaling technology.
Platforms implement a termination voltage level for GTL+ signals defined as VTT. VTT must be
provided via a separate voltage source and not be connected to VCC. This configuration allows for
improved noise tolerance as processor frequency increases. Because of the speed improvements to
the data and address bus, signal integrity and platform design methods have become more critical
than with previous processor families.
The GTL+ inputs require a reference voltage (GTLREF) which is used by the receivers to
determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the system board
(see Table 2-17 for GTLREF specifications). Termination resistors are provided on the processor
silicon and are terminated to VTT. Intel chipsets will also provide on-die termination, thus
eliminating the need to terminate the bus on the system board for most GTL+ signals.
Some GTL+ signals do not include on-die termination and must be terminated on the system board.
See Table 2-4 for details regarding these signals.
The GTL+ bus depends on incident wave switching. Therefore timing calculations for GTL+
signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the
FSB, including trace lengths, is highly recommended when designing a system.
2.2
Power and Ground Lands
For clean on-chip power distribution, the Celeron D processor in the 775-land package has
226 VCC (power), 24 VTT and 273 VSS (ground) lands. All power lands must be connected to
VCC, all VTT lands must be connected to VTT, while all VSS lands must be connected to a system
ground plane. The processor VCC lands must be supplied by the voltage determined by the Voltage
IDentification (VID) signals.
2.3
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is capable of
generating large current swings between low and full power states. This may cause voltages on
power planes to sag below their minimum values if bulk decoupling is not adequate. Care must be
taken in the board design to ensure that the voltage provided to the processor remains within the
specifications listed in Table 2-8. Failure to do so can result in timing violations or reduced lifetime
of the component. For further information, refer to the Voltage Regulator Down (VRD) 10.1 Design
Guide For Desktop LGA775 Socket.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80547RE2533CNS L7TU | 制造商:Intel 功能描述: |
| BX80547RE2667C S L7TM | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.66GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2667CNS L98V | 制造商:Intel 功能描述: |
| BX80547RE2800C S L7TN | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.8GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2800CNS L98W | 制造商:Intel 功能描述:MPU Celeron? D Processor 336 90nm 2.8GHz 775-Pin FCLGA4 |
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