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参数资料
| 型号： | BX80552360 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3460 MHz, MICROPROCESSOR, CBGA775 |
| 封装： | LGA-775 |
| 文件页数： | 2/96页 |
| 文件大小： | 1975K |
| 代理商： | BX80552360 |
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Introduction
10
Datasheet
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
Intel Celeron D Processor 300 sequence on 65 nm process in the 775-
land Package— Processor in the FC-LGA6 package with a 512 KB L2 cache.
Processor — For this document, the term processor is the generic form of the
Celeron D processor.
Keep-out zone — The area on or near the processor that system design can not
use.
Intel 945G/945GZ/945P/945PL Express chipset family — Chipset that
supports DDR and DDR2 memory technology for the Celeron D processor on 65 nm
process.
Processor core — Processor core die with integrated L2 cache.
LGA775 socket — The Celeron D processor on 65 nm process mates with the
system board through a surface mount, 775-land, LGA socket.
Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset; also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
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| BX80552651 | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| BX80552651T | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| BX80552661 | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| BX80552651T2 | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552360 S L9KK | 制造商:Intel 功能描述:MPU CELERON 65NM 3.46GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80552631 | 制造商:Intel 功能描述:Pentium4 Processor 630 3.0GHz with fan |
| BX80552631 S L9KG | 制造商:Intel 功能描述: |
| BX80552641T2 | 制造商:Intel 功能描述:P4 641 3.2GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
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