- 您现在的位置：买卖IC网 > PDF目录298893 > BX80557E2140 (INTEL CORP) MICROPROCESSOR, PBGA775 PDF资料下载
参数资料
| 型号： | BX80557E2140 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROPROCESSOR, PBGA775 |
| 封装： | LGA-775 |
| 文件页数： | 2/107页 |
| 文件大小： | 1474K |
| 代理商： | BX80557E2140 |
第1页当前第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页
Introduction
10
Datasheet
1.1.1
Processor Terminology
Commonly used terms are explained here for clarification:
Intel Pentium Dual-Core Desktop processor E2000 series — Dual core
processor in the FC-LGA6 package with a 1 MB L2 cache.
Processor — For this document, the term processor is the generic form of the
Intel Pentium Dual-Core Desktop processor E2000 series. The processor is a
single package that contains one or more execution units.
Keep-out zone — The area on or near the processor that system design can not
use.
Processor core — Processor core die with integrated L2 cache.
LGA775 socket — The processors mate with the system board through a surface
mount, 775-land, LGA socket.
Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
Execute Disable Bit — The Execute Disable bit allows memory to be marked as
executable or non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms
that exploit buffer over run vulnerabilities and can thus help improve the overall
security of the system. See the Intel Architecture Software Developer's Manual
for more detailed information.
Intel 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of the Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Intel Extended Memory 64 Technology
Software Developer Guide at http://developer.intel.com/technology/
64bitextensions/.
Enhanced Intel SpeedStep Technology — Enhanced Intel SpeedStep
technology allows trade-offs to be made between performance and power
consumptions, based on processor utilization. This may lower average power
consumption (in conjunction with OS support).
相关PDF资料 |
PDF描述 |
|---|---|
| BXM80526B600128 | 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495 |
| BXM80526B700128 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80526B700 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80536GC2100F | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1800F | 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80557E2160 S LA8Z | 制造商:Intel 功能描述: |
| BX80557E4400 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4400 65nm 2GHz 775-Pin FCLGA6 |
| BX80557E4500 S LA95 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4500 65nm 2.2GHz 775-Pin FCLGA6 |
| BX80557E4600 S LA94 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4600 65nm 2.4GHz 775-Pin FCLGA6 |
| BX80557E6300 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intel 功能描述: |
发布紧急采购，3分钟左右您将得到回复。