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参数资料
| 型号： | C0816X7S0G105M |
| 厂商： | TDK Corporation |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 1UF 4V 20% X7S 0603 |
| 产品培训模块： | High Capacitance Replacement |
| 产品目录绘图： | C SERIES_0306/0603_0.6 |
| 特色产品： | C-Series Mid Voltage MLCCs |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 1.0µF |
| 电压 - 额定： | 4V |
| 容差： | ±20% |
| 温度系数： | X7S |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 0603（1608 公制）宽（长侧）0306（0816 公制） |
| 尺寸/尺寸： | 0.031" L x 0.063" W（0.80mm x 1.60mm） |
| 厚度（最大）： | 0.024"（0.60mm） |
| 特点： | 低 ESL 型（倒置结构） |
| 包装： | 标准包装 |
| 产品目录页面： | 2177 (CN2011-ZH PDF) |
| 其它名称： | 445-4066-6 |
General
Specifications
C Series – Low ESL Flip Type
No.
8
Item
Bending
Performance
No mechanical damage.
Test or Inspection Method
Reflow solder the capacitor on P.C. board (shown in
Appendix 2) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
9
Solderability
New solder to cover over 75% of
termination.
25% may have pinholes or rough spots
but not concentrated in one spot.
Ceramic surface of “A sections” shall
not be exposed due to melting or
shifting of termination material.
Completely soak both terminations in solder at 235 ±
5oC for 2 ± 0.5s.
Solder:
H63A (JIS Z 3282)
Flux:
Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
A section
10
Resistance to solder heat
External No cracks are allowed and terminations
appearance shall be covered at least 60% with new
solder.
Completely soak both terminations in solder at 260 ±
5oC for 5 ± 1s.
Preheating condition
Temp. : 150 ± 10oC
Class 2
Capacitance
Characteristics
X7R
X7S
X5R
X6S
Change from the
value before test
± 7.5 %
Time: 1 ~ 2min.
Flux:
Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Solder : H63A (JIS Z 3282)
D.F. (Class 2)
Insulation
Resistance
Voltage proof
TDK MLCC US Catalog
Meet the initial spec.
Meet the initial spec.
No insulation breakdown or other
damage.
Page 204
Leave the capacitor in ambient conditions for 24 ± 2h
before measurement.
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C0816X7S0G105M/10 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0306, T.C: X7S, Voltage: 4, Cap Value: 1000000, Tol: +/-20% |
| C0816X7S0G105M050AC | 制造商:TDK Innoveta 功能描述:Cap Ceramic 1uF 4V X7S 20% SMD 125C T/R 制造商:TDK 功能描述:CAP 1UF 4VDC X7S20% SMD 0816 - Tape and Reel 制造商:TDK 功能描述:CAP CER 1UF 4V 20% X7S 0306 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C0816, T.C:X7S, Voltage:0G, Cap Value:105, Tol:M, Thickness:0.5, E series: 1 |
| C0816X7S0G225M | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 4.0V 2.2uF X7S 20% Flip chip 0306 RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C0816X7S0G225M(050AC) | 制造商:TDK 功能描述:Cut Tape |
| C0816X7S0G225M/10 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0306, T.C: X7S, Voltage: 4, Cap Value: 2200000, Tol: +/-20% |
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