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参数资料
| 型号： | CBTL04083ABS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | PCI/cPCI/PXI |
| 英文描述： | 3.3 V, 4 differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3 |
| 封装： | CBTL04083ABS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.html<1<Always Pb-free,;CBTL04083BBS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.h |
| 文件页数： | 4/18页 |
| 文件大小： | 437K |
| 代理商： | CBTL04083ABS |
CBTL04083A_CBTL04083B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 24 August 2011
12 of 18
NXP Semiconductors
CBTL04083A; CBTL04083B
3.3 V, 4 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBTL04083ABS,518 | 功能描述:编码器、解码器、复用器和解复用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBTL04083ABS,558 | 制造商:NXP Semiconductors 功能描述:CBTL04083ABS/HVQFN42/REEL13DPS// - Tape and Reel |
| CBTL04083BBS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:CBTL04083A/B is a 4 differential channel, 2-to-1 multiplexer/demultiplexer switch for PCI Express Generation 3 (Gen3) applications. |
| CBTL04083BBS,518 | 功能描述:编码器、解码器、复用器和解复用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBTL04083BBS,558 | 功能描述:编码器、解码器、复用器和解复用器 2:1 MUX/DEMUX 3.3V RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
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