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| 型号： | CBTL04083ABS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | PCI/cPCI/PXI |
| 英文描述： | 3.3 V, 4 differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3 |
| 封装： | CBTL04083ABS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.html<1<Always Pb-free,;CBTL04083BBS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.h |
| 文件页数： | 5/18页 |
| 文件大小： | 437K |
| 代理商： | CBTL04083ABS |
CBTL04083A_CBTL04083B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 24 August 2011
13 of 18
NXP Semiconductors
CBTL04083A; CBTL04083B
3.3 V, 4 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBTL04083ABS,518 | 功能描述:编码器、解码器、复用器和解复用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBTL04083ABS,558 | 制造商:NXP Semiconductors 功能描述:CBTL04083ABS/HVQFN42/REEL13DPS// - Tape and Reel |
| CBTL04083BBS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:CBTL04083A/B is a 4 differential channel, 2-to-1 multiplexer/demultiplexer switch for PCI Express Generation 3 (Gen3) applications. |
| CBTL04083BBS,518 | 功能描述:编码器、解码器、复用器和解复用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBTL04083BBS,558 | 功能描述:编码器、解码器、复用器和解复用器 2:1 MUX/DEMUX 3.3V RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
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