参数资料
型号: CM300DX-12A
厂商: Powerex Inc
文件页数: 1/5页
文件大小: 0K
描述: IGBT MOD DUAL 600V 300A NX SER
标准包装: 2
系列: IGBTMOD™
配置: 半桥
电压 - 集电极发射极击穿(最大): 600V
Vge, Ic时的最大Vce(开): 2.1V @ 15V,300A
电流 - 集电极 (Ic)(最大): 300A
电流 - 集电极截止(最大): 1mA
Vce 时的输入电容 (Cies): 34nF @ 10V
功率 - 最大: 960W
输入: 标准
NTC 热敏电阻:
安装类型: 底座安装
封装/外壳: 模块
供应商设备封装: 模块
配用: BG2B-5015-ND - KIT DEV BOARD 2CN 5A FOR IGBT
BG2B-3015-ND - KIT DEV BOARD 2CN 3A FOR IGBT
BG2B-1515-ND - KIT DEV BOARD 1.5A FOR IGBT
BG2A-NF-ND - KIT DEV BOARD FOR IGBT
CM300DX-12A
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272
Dual IGBTMOD?
NX-Series Module
300 Amperes/600 Volts
A
D
E
J
F
G
J
Y
(4 PLACES)
AD
Q
H
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
AE
AF
S T
U
47
24
AA
B
R
Z
AB
K
Q
S T
V
U
W
X
48
M
L
1 2
K
3
4
5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
N P
DETAIL "A"
DETAIL "B"
L
23
AC (4 PLACES)
AL
AG
AJ
AH
Description:
Powerex IGBTMOD? Modules
are designed for use in switching
applications. Each module
AK
AM
C
consists of two IGBT Transistors
in a half-bridge configuration with
Di1
Tr1
AP
AQ
AW
AX
AT
AU
AV
G2(38)
E2(39)
E1C2(24) E1C2(23)
Tr2
Di2
C1(22)
E1(16)
G1(15)
AN
AR
AS
DETAIL "A"
each transistor having a reverse-
connected super-fast recovery
free-wheel diode. All components
and interconnects are isolated from
the heat sinking baseplate, offering
DETAIL "B"
E2
(47)
C1
(48)
TH1
(1)
Th
NTC
TH2
(2)
*ALL PIN DIMENSIONS WITHIN
A TOLERANCE OF ± 0.5
simplified system assembly and
thermal management.
Features:
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
A 5.98 152.0
B 2.44 62.0
C 0.67 17.0
D 5.39 137.0
Dimensions
Z
AA
AB
AC
Inches Millimeters
1.53 39.0
1.97±0.02 50.0±0.5
2.26 57.5
0.22 Dia. 5.5 Dia.
£ Low Drive Power
£ Low V CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
4.79
4.33±0.02
3.89
3.72
0.53
0.15
0.28
0.30
1.95
0.9
0.55
0.87
0.67
0.48
121.7
110.0±0.5
99.0
94.5
13.5
3.8
7.25
7.75
49.54
22.86
14.0
22.0
17.0
12.0
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AQ
AR
AS
0.67+0.04/-0.02 17.0+1.0/-0.5
0.51 13.0
0.27 7.0
0.03 0.8
0.81 20.5
0.12 3.0
0.14 3.5
0.21 5.4
0.49 12.5
0.15 3.81
0.05 1.15
0.025 0.65
0.29 7.4
0.24 6.2
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM300DX-12A is a 600V (V CES ),
300 Ampere Dual IGBTMOD?
Power Module.
U
V
W
X
0.24
0.16
0.37
0.83
6.0
4.2
6.5
21.14
AT
AU
AV
AW
0.17 Dia.
0.10 Dia.
0.08 Dia.
0.06
4.3 Dia.
2.5 Dia.
2.1 Dia.
1.5
Type
CM
Current Rating
Amperes
300
V CES
Volts (x 50)
12
Y
M6
M6
AX
0.49 12.5
Rev. 3/09
1
相关PDF资料
PDF描述
CM300DX-24A IGBT MOD DUAL 1200V 300A NX SER
CM300DY-12H IGBT MOD DUAL 600V 300A H SER
CM300DY-12NF IGBT MOD DUAL 600V 300A NF SER
CM300DY-24A IGBT MOD DUAL 1200V 300A A SER
CM300DY-24H IGBT MOD DUAL 1200V 300A H SER
相关代理商/技术参数
参数描述
CM300DX-24A 功能描述:IGBT MOD DUAL 1200V 300A NX SER RoHS:是 类别:半导体模块 >> IGBT 系列:IGBTMOD™ 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
CM300DX-24S 功能描述:IGBT MOD DUAL 1200V 300A NX SER RoHS:是 类别:半导体模块 >> IGBT 系列:IGBTMOD™ 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
CM300DX-24S1 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:CM300DX-24S1
CM300DX-34SA 制造商:POWEREX 制造商全称:Powerex Power Semiconductors 功能描述:Dual IG NX-Series Module 300 Amperes/1700 Volts
CM300DY-12 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:HIGH POWER SWITCHING USE INSULATED TYPE