参数资料
型号: CMA3000-A01
厂商: Murata Electronics Oy
文件页数: 12/18页
文件大小: 0K
描述: ACCELEROMETER 3-AXIS ANALOG OUT
应用说明: C-Code Examples for CMA3000 Accelerometer
Sub-1 uA Current Consumption with CMA3000
产品培训模块: CMA3000 Accelerometer
产品目录绘图: CMA3000-(A,D)01 Bottom
CMA3000-(A,D)01 Side
标准包装: 1
系列: CMA3000
轴: X,Y,Z
加速范围: ±2g,8g
灵敏度: Vdd/24 V/g,Vdd/6 V/g
电源电压: 1.7 V ~ 3.6 V
输出类型: 模拟
带宽: 120Hz - XZ,200Hz - Y
接口: 并联
安装类型: 表面贴装
封装/外壳: 表面贴装 - 硬币型
产品目录页面: 2828 (CN2011-ZH PDF)
配用: 551-1065-ND - BOARD PWB ACCEL 3AXIS ANALG OUT
其它名称: 551-1063-6
CMA3000 Assembly Instructions
Figure 10. Typical convection reflow soldering phases and profile (IPC/JEDEC J-STD-020C table
5-2 and figure 5-1).
The process window for lead-free soldering is narrower than for traditional eutectic SnPb solders.
Thus, caution has to be taken care when adjusting the reflow profiles. The reflow profile should be
measured using a thermo-couple measurement system. It is recommended that at least three
thermo-couples are used, depending on the application. As a general guide, one thermo-couple
should be placed under a component having the largest thermal mass, one next to the smallest
component, one should be in contact with CMA3000 component's solder joint, and others to the
appropriate spots on a circuit board, e.g. corner, center, bottom of the board etc. The reflow profile
should be adjusted according to the measured data so that each solder joint experiences an
optimal reflow profile. The temperature gradient should be as small as possible across the
circuit board and the components. Extreme caution has to be taken if the circuit board
contains components with vastly different thermal masses.
Underfilling or coating the CMA3000 is not recommended. This can affect on the component
performance.
Murata Electronics Oy
www.muratamems.fi
TN68
12/18
Rev.A.02
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