参数资料
型号: CMA3000-A01
厂商: Murata Electronics Oy
文件页数: 3/18页
文件大小: 0K
描述: ACCELEROMETER 3-AXIS ANALOG OUT
应用说明: C-Code Examples for CMA3000 Accelerometer
Sub-1 uA Current Consumption with CMA3000
产品培训模块: CMA3000 Accelerometer
产品目录绘图: CMA3000-(A,D)01 Bottom
CMA3000-(A,D)01 Side
标准包装: 1
系列: CMA3000
轴: X,Y,Z
加速范围: ±2g,8g
灵敏度: Vdd/24 V/g,Vdd/6 V/g
电源电压: 1.7 V ~ 3.6 V
输出类型: 模拟
带宽: 120Hz - XZ,200Hz - Y
接口: 并联
安装类型: 表面贴装
封装/外壳: 表面贴装 - 硬币型
产品目录页面: 2828 (CN2011-ZH PDF)
配用: 551-1065-ND - BOARD PWB ACCEL 3AXIS ANALG OUT
其它名称: 551-1063-6

CMA3000 Assembly Instructions
1
2
Objective
This document describes guidelines for Printed Wiring Board (PWB) design and assembly of the
CMA3000 3-axis Accelerometer. It also aims to help customers achieve the optimum soldering
process.
Murata's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM)
CMA3000 features a novel packaging concept, which is called Chip-on-MEMS (CoM). Its approach
has been to maintain the benefits of manufacturing the MEMS devices and ASICs on separate
wafers. For this Chip-on-MEMS concept, ASIC chips are flip-chipped onto the MEMS wafer in
known good locations. Redistribution and isolation layers are applied to the MEMS wafer, solder
spheres are provided for external connection before the ASICs are added and the MEMS and
ASIC chips are then isolated using a passivation layer. The concept is illustrated in Figure 1.
Figure 1. The concept of the CMA3000 component.
CoM-technology offers a variety of benefits including reduced lead inductance, an extremely small
sized chip scale package, less than 1mm thin profile, low weight, excellent solderability and
reworkability due to solder spheres. Because the CoM-technology represents the latest in the
surface mount packaging technology, it is important that the design of the printed wiring board, as
well as the assembly process, follow the suggested guidelines outlined in this document.
It should be emphasized that these guidelines are general in nature and should only be considered
as a starting point. The user must employ their actual experiences and development efforts to
optimize designs and processes for their manufacturing practices and the needs of varying end-
use applications.
Murata Electronics Oy
www.muratamems.fi
TN68
3/18
Rev.A.02
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