参数资料
| 型号： | CMPWR330SF |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/10页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .4A SOIC8 |
| 产品变化通告： | Product Discontinuation 30/Sept/2011 |
| 标准包装： | 2,500 |
| 系列： | SmartOR™ |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 5.25V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 400mA（最小值） |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 带卷 (TR) |
CMPWR330
PERFORMANCE INFORMATION (Cont’d)
CMPWR330 Typical Thermal Characteristics
The overall junction to ambient thermal resistance ( q JA )
for device power dissipation (P D ) consists primarily of two
paths in series. The first path is the junction to the case ( q JC )
which is defined by the package style, and the second path
is case to ambient ( q CA ) thermal resistance which is
dependent on board layout. The final operating junction
temperature for any set of conditions can be estimated by the
following thermal equation:
T J + T A ) ( P D )( q JC ) ) ( P D )( q CA )
+ T A ) ( P D )( q JA )
The CMPWR330 uses a thermally enhanced package
where all the GND leads (pins 5 through 8) are integral to the
leadframe. When this package is mounted on a double ? sided
printed circuit board with two square inches of copper
allocated for “heat spreading”, the resulting q JA is about
50 ° C/W .
Based on a typical operating power dissipation of 0.7 W
(1.75 V x 0.4 A) with an ambient of 70 ° C, the resulting
junction temperature will be:
Figure 23. V OUT Variation with T AMB (400 mA Load) T
T J + T A ) ( P D )( q JA )
+ 70° C ) 0.7 W
(50° C W )
+ 70° C ) 35° C + 105° C
The thermal characteristics were measured using
a double ? sided board with two square inches of copper area
connected to the GND pin for “heat spreading”.
Measurements showing performance up to junction
temperature of 125 ° C were performed under light load
conditions (5 mA). This allows the ambient temperature to
be representative of the internal junction temperature.
Figure 24. Select/Deselect Threshold
Variation with T JUNC
NOTE: The use of multi ? layer board construction with
separate ground and power planes will further
enhance the overall thermal performance. In the
event of no copper area being dedicated for heat
spreading, a multi ? layer board construction,
using only the minimum size pad layout, will
provide the CMPWR330 with an overall q JA of
70 ° C/W which allows up to 780 mW to be
safely dissipated for the maximum junction
temperature.
Figure 25. V AUX Switch Resistance vs. T AMB
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