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参数资料
| 型号： | DC1560A |
| 厂商： | Linear Technology |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR LTM8048 |
| 产品培训模块： | LTM8047 and LTM8048 1.5W, 725 VDC Isolated Micromodule Converter |
| 设计资源： | DC1560A Design File DC1560A Schematic |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，LDO 步降 |
| 输出及类型： | 2，隔离 |
| 输出电压： | 5V，6V |
| 电流 - 输出： | 300mA |
| 输入电压： | 4.5 ~ 30 V |
| 稳压器拓扑结构： | 回扫 |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM8048 |
LTM8048
APPLICATIONS INFORMATION
Thermal Considerations
The LTM8048 output current may need to be derated if it
is required to operate in a high ambient temperature. The
amount of current derating is dependent upon the input
voltage, output power and ambient temperature. The
temperature rise curves given in the Typical Performance
Characteristics section can be used as a guide. These curves
were generated by the LTM8048 mounted to a 58cm 2
4-layer FR4 printed circuit board. Boards of other sizes
and layer count can exhibit different thermal behavior, so
it is incumbent upon the user to verify proper operation
over the intended system’s line, load and environmental
operating conditions.
For increased accuracy and fidelity to the actual application,
many designers use FEA to predict thermal performance.
To that end, the Pin Configuration section of the data sheet
typically gives four thermal coefficients:
θ JA : Thermal resistance from junction to ambient
θ JCbottom : Thermal resistance from junction to the bot-
tom of the product case
θ JCtop : Thermal resistance from junction to top of the
product case
θ JCboard : Thermal resistance from junction to the printed
circuit board.
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confu-
sion and inconsistency. These definitions are given in
JESD 51-12, and are quoted or paraphrased as follows:
θ JA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to
as still air although natural convection causes the air to
move. This value is determined with the part mounted to a
JESD 51-9 defined test board, which does not reflect an
actual application or viable operating condition.
θ JCbottom is the junction-to-board thermal resistance with
all of the component power dissipation flowing through the
bottom of the package. In the typical μModule converter,
the bulk of the heat flows out the bottom of the package,
but there is always heat flow out into the ambient envi-
ronment. As a result, this thermal resistance value may
be useful for comparing packages but the test conditions
don’t generally match the user’s application.
θ JCtop is determined with nearly all of the component power
dissipation flowing through the top of the package. As the
electrical connections of the typical μModule converter are
on the bottom of the package, it is rare for an application
to operate such that most of the heat flows from the junc-
tion to the top of the part. As in the case of θ JCbottom , this
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
θ JCboard is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
μModule converter and into the board, and is really the
sum of the θ JCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two-sided,
two-layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a μModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
8048ff
14
For more information www.linear.com/LTM8048
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