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参数资料
| 型号： | DC1560A |
| 厂商： | Linear Technology |
| 文件页数： | 2/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR LTM8048 |
| 产品培训模块： | LTM8047 and LTM8048 1.5W, 725 VDC Isolated Micromodule Converter |
| 设计资源： | DC1560A Design File DC1560A Schematic |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，LDO 步降 |
| 输出及类型： | 2，隔离 |
| 输出电压： | 5V，6V |
| 电流 - 输出： | 300mA |
| 输入电压： | 4.5 ~ 30 V |
| 稳压器拓扑结构： | 回扫 |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM8048 |
LTM8048
ABSOLUTE MAXIMUM RATINGS
(Note 1)
PIN CONFIGURATION
V OUT–
V OUT2
V OUT1
V IN
V IN ,RUN,BIAS ........................................................32V
ADJ1, SS .....................................................................5V
V OUT1 Relative to V OUT– ............................................16V
(V IN – GND) + (V OUT1 – V OUT– ) .................................36V
V OUT2 Relative to V OUT– ..........................................+20V
ADJ2 Relative to V OUT– .............................................+7V
BYP Relative to V OUT– ............................................+0.6V
BIAS Above V IN ........................................................ 0.1V
GND to V OUT– Isolation (Note 2) ........................ 725VDC
Maximum Internal Temperature (Note 3) .............. 125°C
Maximum Solder Temperature .............................. 250°C
Storage Temperature.............................. –55°C to 125°C
A
B
C
D
E
F
G
H
TOP VIEW
ADJ2
BANK 3 BANK 2 BANK 1
BYP
BANK 5
RUN
BIAS SS
1 2 3 4 5 6 7
BGA PACKAGE
45-LEAD (11.25mm × 9mm × 4.92mm)
BANK 4
GND
ADJ1
T JMAX = 125°C, θ JA = 23.2°C/W, θ JCbottom = 5.8°C/W, θ JCtop = 23.2°C/W, θ JB = 6.7°C/W
WEIGHT = 1.1g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
PART NUMBER
PAD OR BALL
FINISH
PART MARKING*
DEVICE FINISH CODE
PACKAGE TYPE
MSL RATING
TEMPERATURE RANGE (NOTE 3)
LTM8048EY#PBF
LTM8048IY#PBF
LTM8048IY
LTM8048MPY#PBF
LTM8048MPY
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
LTM8048Y
LTM8048Y
LTM8048Y
LTM8048Y
LTM8048Y
e1
e1
e0
e1
e0
BGA
BGA
BGA
BGA
BGA
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Pb-free & Non-Pb-free Part Markings:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? BGA Package and Tray Drawings:
www.linear.com/packaging/
8048ff
2
For more information www.linear.com/LTM8048
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