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参数资料
| 型号： | DC1623A |
| 厂商： | Linear Technology |
| 文件页数： | 16/26页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL LTM8003 |
| 软件下载： | LTM8033 Spice Model |
| 设计资源： | DC1623A Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 3.3V |
| 电流 - 输出： | 3A |
| 输入电压： | 5.5 ~ 36 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 425kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM8033 |
LTM8033
APPLICATIONS INFORMATION
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8033. The LTM8033 is neverthe-
less a switching power supply, and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 4
for a suggested layout. Ensure that the grounding and
heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the R ADJ and R T resistors as close as possible to
their respective pins.
2. Place the C IN and C FIN capacitors as close as possible
to the V IN , FIN and GND connections of the LTM8033.
A haphazardly placed C FIN capacitor may impair EMI
performance.
3. Place the C OUT capacitors as close as possible to the
V OUT and GND connection of the LTM8033.
PG SYNC
4. Place the C IN , C FIN and C OUT capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8033.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8033.
6. Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND
vias to provide both a good ground connection and
thermal path to the internal planes of the printed circuit
board. Pay attention to the location and density of the
thermal vias in Figure 4. The LTM8033 can benefit from
the heat sinking afforded by vias that connect to internal
GND planes at these locations, due to their proximity
to internal power handling components. The optimum
number of thermal vias depends upon the printed
circuit board design. For example, a board might use
very small via holes. It should employ more thermal
vias than a board that uses larger holes.
R ADJ
R T
SHARE
GND
V OUT
GND
C OUT
GND
RUN/SS
BIAS
AUX
C IN
FIN
LTM8033
V IN
C FIN
THERMAL VIAS TO GND
Figure 4. Layout Showing Suggested External
Components, GND Plane and Thermal Vias
8033fa
16
For more information www.linear.com/LTM8033
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DC1625A-A | 功能描述:BOARD DEMO FOR LTC4227-1 RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| DC1625A-B | 功能描述:BOARD DEMO FOR LTC4227-2 RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| DC1627 | 制造商:INTRONICS 制造商全称:INTRONICS 功能描述:15 Watt Triple Output DC-DC Converters |
| DC1627A-A | 制造商:Linear Technology 功能描述:EVAL BOARD FOR LTC4226-1 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4226 HOT SWAP CONTROLLER, Silicon Manufacturer:Linear Technology, Silicon Core Number:LTC4226CUD-1, Kit Application Type:Power Management, Application Sub Type:Hot Swap Controller, Kit Contents:Demo Board LTC4226CUD-1 , RoHS Compliant: NA |
| DC1627A-B | 制造商:Linear Technology 功能描述:EVAL BOARD FOR LTC4226-2 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4226 HOT SWAP CONTROLLER, Silicon Manufacturer:Linear Technology, Silicon Core Number:LTC4226CUD-2, Kit Application Type:Power Management, Application Sub Type:Hot Swap Controller, Kit Contents:Demo Board LTC4226CUD-2 , RoHS Compliant: NA |
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