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参数资料
| 型号： | DC1623A |
| 厂商： | Linear Technology |
| 文件页数： | 2/26页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL LTM8003 |
| 软件下载： | LTM8033 Spice Model |
| 设计资源： | DC1623A Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 3.3V |
| 电流 - 输出： | 3A |
| 输入电压： | 5.5 ~ 36 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 425kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM8033 |
LTM8033
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V IN , FIN, RUN/SS Voltage ........................................36V
ADJ, RT, SHARE Voltage ............................................6V
V OUT , AUX ................................................................25V
PGOOD, SYNC ..........................................................30V
PIN CONFIGURATION
TOP VIEW
BIAS .........................................................................25V
Maximum Junction Temperature (Note 2) .......... 125°C
Solder Temperature ............................................. 245°C
TOP VIEW
8
GND SYNC
RUN/SS
8
GND SYNC
RUN/SS
7
ADJ PGOOD
BANK 3
FIN
7
ADJ PGOOD
BANK 3
FIN
6
5
SHARE RT
BANK 2
6
5
SHARE RT
BANK 2
4
GND
BIAS
4
GND
BIAS
3
2
1
BANK 1
VOUT
AUX
BANK 4
VIN
3
2
1
BANK 1
VOUT
AUX
BANK 4
VIN
A
B
C
D
E
F
G
H
J
K
L
A
B
C
D
E
F
G
H
J
K
L
LGA PACKAGE
76-LEAD (15mm × 11.25mm × 4.32mm)
T JMAX = 125°C, θ JA = 15.4°C/W, θ JCbottom = 5.2°C/W, θ JB = 9.8°C/W, θ JCtop = 16.7°C/W
θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB
WEIGHT = 2.2g
ORDER INFORMATION
BGA PACKAGE
76-LEAD (15mm × 11.25mm × 4.92mm)
T JMAX = 125°C, θ JA = 15.4°C/W, θ JCbottom = 5.2°C/W, θ JB = 9.8°C/W, θ JCtop = 16.7°C/W
θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB
WEIGHT = 2.2g
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM8033EV#PBF
LTM8033IV#PBF
LTM8033MPV#PBF
LTM8033EY#PBF
LTM8033IY#PBF
LTM8033IY
LTM8033MPY#PBF
LTM8033MPY
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/67)
SAC305 (RoHS)
SnPb (63/67)
LTM8033V
LTM8033V
LTM8033V
LTM8033Y
LTM8033Y
LTM8033Y
LTM8033Y
LTM8033Y
e4
e4
e4
e1
e1
e0
e1
e0
LGA
LGA
LGA
BGA
BGA
BGA
BGA
BGA
3
3
3
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Terminal Finish Part Marking:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8033fa
2
For more information www.linear.com/LTM8033
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