- 您现在的位置：买卖IC网 > PDF目录20407 > DC1743A (Linear Technology)BOARD DEMO LTM4613 PDF资料下载
参数资料
| 型号： | DC1743A |
| 厂商： | Linear Technology |
| 文件页数： | 18/28页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO LTM4613 |
| 产品培训模块： | µModule® Family of EN55022 Class B Certified Regulators |
| 设计资源： | DC1743A Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 3.3V，5V，12V |
| 电流 - 输出： | 8A |
| 输入电压： | 5 ~ 36 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 165kHz，250kHz，600kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4613 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页当前第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
LTM4613
APPLICATIONS INFORMATION
A graphical representation of the aforementioned thermal
resistances is given in Figure 8. Blue resistances are
contained within the μModule package, whereas green
resistances are external to the μModule package.
As a practical matter, it should be clear to the reader that
no individual or sub group of the four thermal resistance
parameters defined by JESD51-12, or provided in the
Pin Configuration section, replicates or conveys normal
operating conditions of a μModule regulator. For example,
in normal board-mounted applications, never does 100%
of the device’s total power loss (heat) thermally conduct
exclusively through the top or exclusively through bottom
of the package—as the standard defines for θ JCtop and
θ JCbottom , respectively. In practice, power loss is thermally
dissipated in both directions away from the package.
Granted, in the absence of a heat sink and airflow, the
majority of the heat flow is into the board.
Within a SIP (System-In-Package) module, be aware that
there are multiple power devices and components dissipat-
ing power, with a consequence that the thermal resistances
relative to different junctions of components or die are not
exactly linear with respect to total package power loss. To
reconcile this complication without sacrificing modeling
simplicity—but also, not ignoring practical realities—an
approach has been taken using FEA software modeling
along with laboratory testing in a controlled environment
chamber to reasonably define and correlate the thermal
resistance values supplied in this data sheet:
1. Initially, FEA software is used to accurately build the
mechanical geometry of the μModule regulator and the
specified PCB with all of the correct material coefficients,
along with accurate power loss source definitions;
2. This model simulates a software-defined JEDEC envi-
ronment consistent with JSED51-9 to predict power
loss heat flow and temperature readings at different
interfaces that enable the calculation of the JEDEC-
defined thermal resistance values;
3. The model and FEA software is used to evaluate the
μModule regulator with heat sinks and airflow;
4. Having solved for, and analyzed these thermal resistance
values and simulated various operating conditions in
the software model, a thorough laboratory evaluation
replicates the simulated conditions with thermocouples
within a controlled environment chamber while operat-
ing the device at the same power loss as that which
was simulated.
An outcome of this process and due diligence yields a set
of derating curves provided in other sections of this data
sheet. After these laboratory tests have been performed
and correlated to the μModule regulator model, the θ JB
and θ JA are summed together to correlate quite well with
the μModule regulator model, with no airflow or heat sink-
ing, in a properly defined chamber. This θ JB + θ JA value
is shown in the Pin Configuration section, and should
accurately equal the θ JA value in this section, because
approximately 100% of power loss flows from the junc-
tion through the board into ambient with no airflow or top
mounted heat sink.
The power loss curves in Figures 9 and 10 can be used
in coordination with the load current derating curves in
Figures 11 to 16 for calculating an approximate θ JA for
the module. Each figure has three curves that are taken
at three different airflow conditions. Graph designation
delineates between no heat sink, and a BGA heat sink. Each
of the load current derating curves will lower the maxi-
mum load current as a function of the increased ambient
temperature to keep the maximum junction temperature
of the power module at 125°C maximum. This will main-
tain the maximum operating temperature below 125°C.
Table?3 provides the approximate θ JA for Figures 11 to 16.
A complete explanation of the thermal characteristics is
provided in the thermal application note, AN110.
4613f
18
相关PDF资料 |
PDF描述 |
|---|---|
| RLB0712-151KL | INDUCTOR 150UH 10% RADIAL |
| 346-080-521-201 | CARDEDGE 80POS DUAL .125 GREEN |
| RCM12DCMN | CONN EDGECARD 24POS .156 WW |
| BAS16TW-7 | DIODE SW ARRAY 75V 200MW SC70-6 |
| MKP1V130RL | SIDAC BIDIR 0.9A 130V DO-41 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DC1746A-A | 功能描述:EVALUATION KIT LOW EMI LTM2881-3 RoHS:否 类别:编程器，开发系统 >> 评估演示板和套件 系列:µModule® 标准包装:1 系列:- 主要目的:数字电位器 嵌入式:- 已用 IC / 零件:AD5258 主要属性:- 次要属性:- 已供物品:板 相关产品:AD5258BRMZ1-ND - IC POT DGTL I2C1K 64P 10MSOPAD5258BRMZ10-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ100-ND - IC POT DGTL I2C 100K 64P 10MSOPAD5258BRMZ50-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ1-R7-ND - IC POT DGTL I2C 1K 64P 10MSOPAD5258BRMZ10-R7-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ50-R7-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ100-R7-ND - IC POT DGTL I2C 100K 64P 10MSOP |
| DC1746A-B | 功能描述:EVALUATION KIT LOW EMI LTM2881-5 RoHS:否 类别:编程器，开发系统 >> 评估演示板和套件 系列:µModule® 标准包装:1 系列:- 主要目的:数字电位器 嵌入式:- 已用 IC / 零件:AD5258 主要属性:- 次要属性:- 已供物品:板 相关产品:AD5258BRMZ1-ND - IC POT DGTL I2C1K 64P 10MSOPAD5258BRMZ10-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ100-ND - IC POT DGTL I2C 100K 64P 10MSOPAD5258BRMZ50-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ1-R7-ND - IC POT DGTL I2C 1K 64P 10MSOPAD5258BRMZ10-R7-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ50-R7-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ100-R7-ND - IC POT DGTL I2C 100K 64P 10MSOP |
| DC1747A-A | 功能描述:EVALUATION LOW EM1 KIT LTM2882-3 RoHS:否 类别:编程器，开发系统 >> 评估演示板和套件 系列:µModule® 标准包装:1 系列:- 主要目的:数字电位器 嵌入式:- 已用 IC / 零件:AD5258 主要属性:- 次要属性:- 已供物品:板 相关产品:AD5258BRMZ1-ND - IC POT DGTL I2C1K 64P 10MSOPAD5258BRMZ10-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ100-ND - IC POT DGTL I2C 100K 64P 10MSOPAD5258BRMZ50-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ1-R7-ND - IC POT DGTL I2C 1K 64P 10MSOPAD5258BRMZ10-R7-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ50-R7-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ100-R7-ND - IC POT DGTL I2C 100K 64P 10MSOP |
| DC1747A-B | 功能描述:EVALUATION KIT LOW EM1 LTM2882-5 RoHS:否 类别:编程器，开发系统 >> 评估演示板和套件 系列:µModule® 标准包装:1 系列:- 主要目的:数字电位器 嵌入式:- 已用 IC / 零件:AD5258 主要属性:- 次要属性:- 已供物品:板 相关产品:AD5258BRMZ1-ND - IC POT DGTL I2C1K 64P 10MSOPAD5258BRMZ10-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ100-ND - IC POT DGTL I2C 100K 64P 10MSOPAD5258BRMZ50-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ1-R7-ND - IC POT DGTL I2C 1K 64P 10MSOPAD5258BRMZ10-R7-ND - IC POT DGTL I2C 10K 64P 10MSOPAD5258BRMZ50-R7-ND - IC POT DGTL I2C 50K 64P 10MSOPAD5258BRMZ100-R7-ND - IC POT DGTL I2C 100K 64P 10MSOP |
| DC1748A-A | 制造商:Linear Technology 功能描述:BOARD EVAL FOR LTM2883 |
发布紧急采购，3分钟左右您将得到回复。