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参数资料
| 型号： | DC682A |
| 厂商： | Linear Technology |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | BOARD SAR ADC LTC1859 |
| 软件下载： | QuikEval System |
| 设计资源： | DC682A Design File DC682A Schematic |
| 标准包装： | 1 |
| 系列： | QuikEval™, SoftSpan™ |
| ADC 的数量： | 1 |
| 位数： | 16 |
| 采样率（每秒）： | 100k |
| 数据接口： | MICROWIRE?，串行，SPI? |
| 工作温度： | 0°C ~ 70°C |
| 已用 IC / 零件： | LTC1859 |
| 已供物品： | 板 |
| 相关产品： | LTC1859CG#PBF-ND - IC ADC 8CH 16BIT 100KSPS 28-SSOP LTC1859IG#PBF-ND - IC A/D CONV 8CH 16BIT 28-SSOP LTC1859IG#TRPBF-ND - IC A/D CONV 8CH 16BIT 28-SSOP LTC1859CG#TRPBF-ND - IC A/D CONV 8CH 16BIT 28-SSOP |
LTC1857/LTC1858/LTC1859
19
185789fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
APPLICATIONS INFORMATION
1859 F13
ADC+
LTC1857/LTC1858/LTC1859
DIGITAL
SYSTEM
OVDD
DGND
24
21
ADC–
10μF
DVDD
20
10μF
AVDD
19
AGND
14, 17, 18
10μF
REFCOMP
16
10μF
VREF
15
12
MUXOUT+
LTC1857/
LTC1858/
LTC1859
MUXOUT–
10
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
11
13
1μF
ANALOG GROUND PLANE
+
–
Figure 13. Power Supply Grounding Practice
LTC1858/LTC1859 can be tied to the analog ground plane.
Placing the bypass capacitor as close as possible to the
power supply pins, the reference and reference buffer out-
put is very important. Low impedance common returns for
these bypass capacitors are essential to low noise operation
of the ADC, and the foil width for these tracks should be
as wide as possible. Also, since any potential difference in
grounds between the signal source and ADC appears as
an error voltage in series with the input signal, attention
should be paid to reducing the ground circuit impedance
as much as possible. The digital output latches and the
onboard sampling clock have been placed on the digital
ground plane. The two ground planes are tied together at
the power supply ground connection.
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
0.09 – 0.25
(.0035 – .010)
0
° – 8°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
G28 SSOP 0204
7.40 – 8.20
(.291 – .323)
12 3
4
5
6 7 8
9 10 11 12
14
13
9.90 – 10.50*
(.390 – .413)
25
26
22 21 20 19 18 17 16 15
23
24
27
28
2.0
(.079)
MAX
0.05
(.002)
MIN
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42
±0.03
0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25
±0.12
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