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参数资料
| 型号： | DC798B |
| 厂商： | Linear Technology |
| 文件页数： | 35/42页 |
| 文件大小： | 0K |
| 描述： | BOARD DELTA SIGMA ADC LTC2480 |
| 软件下载： | QuikEval System |
| 设计资源： | DC798B Design File DC798B Schematic |
| 标准包装： | 1 |
| 系列： | QuikEval™ |
| ADC 的数量： | 1 |
| 位数： | 16 |
| 采样率（每秒）： | 7.5 |
| 数据接口： | MICROWIRE?，串行，SPI? |
| 已用 IC / 零件： | LTC2480 |
| 已供物品： | 板 |
| 相关产品： | LTC2480HMS#TRPBF-ND - IC ADC DELTA SIGMA 16BIT 10MSOP LTC2480HDD#TRPBF-ND - IC ADC DELTA SIGMA 16BIT 10DFN LTC2480HDD#PBF-ND - IC ADC 16BIT SRL 7.5SPS 10DFN LTC2480HMS#PBF-ND - IC ADC 16BIT SER/SPI 10MSOP LTC2480IMS#TRPBF-ND - IC ADC 16BIT 10-MSOP LTC2480IMS#PBF-ND - IC ADC 16BIT 10-MSOP LTC2480IDD#TRPBF-ND - IC ADC 16BIT 10-DFN LTC2480CMS#TRPBF-ND - IC ADC 16BIT 10-MSOP LTC2480CMS#PBF-ND - IC ADC 16BIT 10-MSOP LTC2480CDD#TRPBF-ND - IC ADC 16BIT 10-DFN 更多... |
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LTC2480
0
2480fd
package DescripTion
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E)
MSOP (MS) 0307 REV E
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8
9
10
7 6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.254
(.010)
0° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 0.10
(2 SIDES)
0.75 0.05
R = 0.125
TYP
2.38 0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25 0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.70 0.05
3.55 0.05
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
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