参数资料
型号: DC823B-B
厂商: Linear Technology
文件页数: 16/24页
文件大小: 0K
描述: BOARD EVAL LTM4600HV
软件下载: LTM4600HV Spice Model
设计资源: DC823B-B Design Files
DC823B-B Schematic
标准包装: 1
系列: µModule®
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 0.6V,1.2V,1.5V,1.8V,2.5V,3.3V,和 5V
电流 - 输出: 10A(最小值)
输入电压: 4.5 ~ 28 V
稳压器拓扑结构: 降压
频率 - 开关: 1.35MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LTM4600HV
相关产品: LTM4600HVIV#PBF-ND - IC DC/DC UMODULE 10A 104-LGA
LTM4600HVEV#PBF-ND - IC DC/DC UMODULE 10A 104-LGA
LTM4600HV
APPLICATIO S I FOR ATIO
10
9
V IN = 12V
V OUT = 3.3V
10
8
V IN = 24V
V OUT = 3.3V TEMPERATURE
DE-RATING
10
9
0 LFM
200 LFM
400 LFM
8
7
6
6
4
8
7
6
5
4
40
0 LFM
200 LFM
400 LFM
50 60
70
80 90
100
2
0
50
0 LFM
200 LFM
400 LFM
60
70
80
90
5 V IN = 24V
V OUT = 3.3V TEMPERATURE
DE-RATING
4
50 60 70
80
90
AMBIENT TEMPERATURE ( ° C)
4600hv F17
Figure 17. BGA Heatsink
Table 3. 1.5V Output
AMBIENT TEMPERATURE ( ° C)
4600hv F18.eps
Figure 18. No Heatsink
AMBIENT TEMPERATURE ( ° C)
4600hv F19.eps
Figure 19. BGA Heatsink
DERATING CURVE
Figures 9, 11, 13
Figures 9, 11, 13
Figures 9, 11, 13
Figures 10, 12, 14
Figures 10, 12, 14
Figures 10, 12, 14
V IN (V)
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
POWER LOSS CURVE
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14
12
13.9
11.3
10.25
Table 4. 3.3V Output
DERATING CURVE
Figures 16, 18
Figures 16, 18
Figures 16, 18
Figures 17, 19
Figures 17, 19
Figures 17, 19
V IN (V)
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
POWER LOSS CURVE
Figure 15
Figure 15
Figure 15
Figure 15
Figure 15
Figure 15
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14.6
13.4
13.9
11.1
10.5
4600hvfc
16
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