参数资料
型号: DS100BR111SQE/NOPB
厂商: National Semiconductor
文件页数: 7/43页
文件大小: 0K
描述: IC REPEATER 10.3GBPS 2CH 24LLP
标准包装: 250
系列: *
SNLS338E – JANUARY 2011 – REVISED FEBRUARY 2013
Power Supply Configuration Guidelines
The DS100BR111 can be configured for 2.5V operation or 3.3V operation. The lists below outline required
connections for each supply selection.
3.3V Mode of Operation
1. Tie VDD_SEL = 0 with 1K resistor to GND.
2. Feed 3.3V supply into VIN pin. Local 1.0 uF decoupling at VIN is recommended.
3. See information on VDD bypass below.
4. SDA and SCL pins should connect pull-up resistor to VIN
5. Any 4-Level input which requires a connection to "Logic 1" should use a 1K resistor to VIN
2.5V Mode of Operation
6. VDD_SEL = Float
7. VIN = Float
8. Feed 2.5V supply into VDD pins.
9. See information on VDD bypass below.
10. SDA and SCL pins connect pull-up resistor to VDD for 2.5V uC SMBus IO
11. SDA and SCL pins connect pull-up resistor to VDD for 3.3V uC SMBus IO
12. Any 4-Level input which requires a connection to "Logic 1" should use a 1K resistor to VIN
NOTE
The DAP (bottom solder pad) is the GND connection.
Power Supply Bypass
Two approaches are recommended to ensure that the DS100BR111 is provided with an adequate power supply.
First, the supply (VDD) and ground (GND) pins should be connected to power planes routed on adjacent layers
of the printed circuit board. The layer thickness of the dielectric should be minimized so that the VDD and GND
planes create a low inductance supply with distributed capacitance. Second, careful attention to supply
bypassing through the proper use of bypass capacitors is required. A 0.1
μF bypass capacitor should be
connected to each VDD pin such that the capacitor is placed as close as possible to the device. Smaller body size
capacitors can help facilitate proper component placement.
System Management Bus (SMBus) and Configuration Registers
The System Management Bus interface is compatible to SMBus 2.0 physical layer specification. ENSMB must be
pulled high to enable SMBus mode and allow access to the configuration registers.
The DS100BR111 has AD[3:0] inputs in SMBus mode. These pins are the user set SMBus slave address inputs.
When pulled low the AD[3:0] = 0000'b, the device default address byte is B0'h. Based on the SMBus 2.0
specification, this configuration results in a 7-bit slave address of 1011000'b. The LSB is set to 0'b (for a WRITE),
thus the 8-bit value is 1011 0000'b or B0'h. The device address byte can be set with the use of the AD[3:0]
inputs.
Shown in the form of an expression:
Slave Address [7:4] = The DS100BR111 hardware address (1011'b) + Address pin AD[3]
Slave Address [3:1] = Address pins AD[2:0]
Slave Address [0] = 0'b for a WRITE or 1'b for a READ
Slave Address Examples:
AD[3:0] = 0001'b, the device slave address byte is B2'h
Slave Address [7:4] = 1011'b + 0'b = 1011'b or B'h
Slave Address [3:1] = 001'b
Slave Address [0] = 0'b for a WRITE
AD[3:0] = 0010'b, the device slave address byte is B4'h
Copyright 2011–2013, Texas Instruments Incorporated
15
Product Folder Links: DS100BR111
相关PDF资料
PDF描述
DS10BR254TSQX/NOPB IC LVDS REPEAT 1.5GBPS 1:4 40LLP
DS1210SN/T&R IC CONTROLLER CHIP NV IND 16SOIC
DS1211SN+T&R IC CONTROLLER 8-CHIP NV 20-SOIC
DS1212+ IC CONTROLLER NV 16-CHIP 28-DIP
DS1213B IC SMARTSOCKET 16K/64K 28-DIP
相关代理商/技术参数
参数描述
DS100BR210 制造商:TI 制造商全称:Texas Instruments 功能描述:Ultra Low Power 10.3 Gbps 2-Channel Repeater with Input Equalization and Output De-Emphasis
DS100BR210EVK 功能描述:其他开发工具 DS100BR210 EVAL BOARD RoHS:否 制造商:Parallax 产品:ELEV-8 Hex Upgrade Kits 类型:Robotics 工具用于评估:ELEV-8 Quadcopter 工作电源电压:
DS100BR210EVK/NOPB 功能描述:其他开发工具 DS100BR210 EVAL BOARD RoHS:否 制造商:Parallax 产品:ELEV-8 Hex Upgrade Kits 类型:Robotics 工具用于评估:ELEV-8 Quadcopter 工作电源电压:
DS100BR210SQ 制造商:TI 制造商全称:Texas Instruments 功能描述:Ultra Low Power 10.3 Gbps 2-Channel Repeater with Input Equalization and Output De-Emphasis
DS100BR210SQ/NOPB 功能描述:IC REPEATER 10.3GBPS 2CH 24LLP RoHS:是 类别:集成电路 (IC) >> 接口 - 信号缓冲器,中继器,分配器 系列:* 标准包装:160 系列:- 类型:转发器 Tx/Rx类型:以太网 延迟时间:- 电容 - 输入:- 电源电压:2.37 V ~ 2.63 V 电流 - 电源:60mA 安装类型:表面贴装 封装/外壳:64-TQFP 裸露焊盘 供应商设备封装:64-TQFP-EP(10x10) 包装:托盘 其它名称:Q5134101