参数资料
型号: DS1340U-3+T&R
厂商: Maxim Integrated Products
文件页数: 14/16页
文件大小: 0K
描述: IC RTC I2C W/CHARGER 3V 8-USOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 3,000
类型: 时钟/日历
特点: 闰年,方波输出,涓流充电器
时间格式: HH:MM:SS(24 小时)
数据格式: YY-MM-DD-dd
接口: I²C,2 线串口
电源电压: 2.7 V ~ 5.5 V
电压 - 电源,电池: 1.3 V ~ 3.7 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-uMAX
包装: 带卷 (TR)
I2C RTC with Trickle Charger
Maxim Integrated
7
DS1340
when VCC drops below VBACKUP. The registers are
maintained from the VBACKUP source until VCC is
returned to nominal levels (Table 1). After VCC returns
above VPF, read and write access is allowed tREC.
Oscillator Circuit
The DS1340 uses an external 32.768kHz crystal. The
oscillator circuit does not require any external resistors
or capacitors to operate. Table 2 specifies several crys-
tal parameters for the external crystal. Figure 3 shows a
functional schematic of the oscillator circuit. If using a
crystal with the specified characteristics, the startup
time is usually less than one second.
Clock Accuracy
The initial clock accuracy depends on the accuracy of
the crystal and the accuracy of the match between the
capacitive load of the oscillator circuit and the capaci-
tive load for which the crystal was trimmed. Additional
error is added by crystal frequency drift caused by
temperature shifts. External circuit noise coupled into
the oscillator circuit can result in the clock running fast.
Figure 4 shows a typical PC board layout for isolating
the crystal and oscillator from noise. Refer to
Application Note 58: Crystal Considerations with Dallas
Real-Time Clocks (www.maximintegrated.com/RTCapps)
for detailed information.
DS1340C Only
The DS1340C integrates a standard 32,768Hz crystal
into the package. Typical accuracy with nominal VCC
and +25°C is approximately +15ppm. Refer to
Application Note 58 for information about crystal accu-
racy vs. temperature.
Operation
The DS1340 operates as a slave device on the serial
bus. Access is obtained by implementing a START
condition and providing a device identification code fol-
lowed by data. Subsequent registers can be accessed
sequentially until a STOP condition is executed. The
device is fully accessible and data can be written and
read when VCC is greater than VPF. However, when
VCC falls below VPF, the internal clock registers are
blocked from any access. If VPF is less than VBACKUP,
the device power is switched from VCC to VBACKUP
when VCC drops below VPF. If VPF is greater than
VBACKUP, the device power is switched from VCC to
VBACKUP when VCC drops below VBACKUP. The regis-
ters are maintained from the VBACKUP source until VCC
is returned to nominal levels. The functional diagram
(Figure 5) shows the main elements of the serial RTC.
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Nominal
Frequency
fO
32.768
kHz
Series Resistance
ESR
80
k
Ω
Load Capacitance
CL
12.5
pF
Table 2. Crystal Specifications*
*
The crystal, traces, and crystal input pins should be isolated
from RF generating signals. Refer to Application Note 58:
Crystal Considerations for Dallas Real-Time Clocks
for addi-
tional specifications.
COUNTDOWN
CHAIN
RTC
X1
X2
CL1
CL2
CRYSTAL
RTC
REGISTERS
Figure 3. Oscillator Circuit Showing Internal Bias Network
CRYSTAL
X1
X2
GND
LOCAL GROUND PLANE (LAYER 2)
Figure 4. Layout Example
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