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参数资料
| 型号： | DS2152L |
| 厂商： | DALLAS SEMICONDUCTOR |
| 元件分类： | Digital Transmission Controller |
| 英文描述： | DATACOM, FRAMER, PQFP100 |
| 封装： | LQFP-100 |
| 文件页数： | 7/14页 |
| 文件大小： | 1398K |
| 代理商： | DS2152L |
2
Maxim Integrated
Adjustable Overvoltage and Overcurrent
Protectors with High Accuracy
MAX14571/MAX14572/MAX14573
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
IN, HVEN ................................................................-40V to +40V
IN to OUT ...............................................................-40V to +40V
OUT ......................................................................-0.3V to +40V
OVLO, UVLO, FLAG, EN, RIEN............................-0.3V to +6.0V
Current into IN (DC Operating) (Note 1).............. ………….4.2A
SETI .......................... ………….-0.3V to Min (VIN, 1.22V) + 0.3V
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate 25.6mW/NC above +70NC)........ ….2051.3mW
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature ........................................………..+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................. …………+300NC
Soldering Temperature (reflow) ....................... …………+260NC
ELECTRICAL CHARACTERISTICS
(
VIN = 4.5V to 36V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VIN = 24V, RISET = 12kI, TA = +25°C.) (Note 3)
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Note 1: DC current is also limited by the thermal design of the system.
TSSOP
Junction-to-Ambient Thermal Resistance (BJA) ........... +39NC/W
Junction-to-Case Thermal Resistance (BJC).................. +3NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
IN Voltage Range
VIN
4.5
36
V
Shutdown Input Current
ISHDN
VEN = 0V, VHVEN = 5V
15
F
A
Shutdown Output Current
IOFF
VOUT = 0V
2
F
A
Reverse Input Current
IIN_RVS
VIN = -40V, VOUT = VGND = 0V
-35
F
A
Supply Current
IIN
VIN = 15V, RISET = 12kI
490
700
F
A
Internal Overvoltage Trip Level
VOVLO
VIN rising
32
33
34
V
VIN falling
32
Internal Undervoltage Trip Level
VUVLO
VIN falling
17.5
18.5
19.5
V
VIN rising
18.2
19.2
20.2
Overvoltage-Lockout Hysteresis
% of typical OVLO
3
%
External OVLO Adjustment Range
(Note 4)
6
36
V
External OVLO Select Voltage
VOVLOSEL
0.3
0.50
V
External OVLO Leakage Current
IOVLO_LEAK VOVLO < 1.2V (Note 5)
-100
+100
nA
External UVLO Adjustment Range
4.5
24
V
External UVLO Select Voltage
VOVLOSEL
0.3
0.50
V
External UVLO Leakage Current
IUVLO_LEAK (Note 5)
-100
+100
nA
BG Reference Voltage
VBG
1.186
1.210
1.234
V
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